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Sample Preparation Tools

SEM Ion Etching and Coating

STEM-SEM

Model 682 PECS Precision Etching & Coating System For any application requiring sample cleaning or etching followed by high-resolution sputter coating. Includes ion cutting option to section specimens

  

  

  

  

Plasma Cleaning System (Gatan Solarus Model 950)

cleaning

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SEM Specimen Ion Mill for Sectioning and Polishing

Cross scetion polisher

The Cross Section Polisher (CP) Clean polished cross section of almost any material in simple steps The CP can prepare a perfect cross section from almost any material such as; Difficult-to-polish soft materials such as copper, aluminum, gold, solder, and polymer, Difficult-to-cut hard materials such as ceramic and glass, and Composites of these materials. The cross section prepared by the CP is suitable for EDS, WDS, Auger, and EBSD (Electron Back Scatter Diffraction) analysis, and for observation and measurement of multi-layered structures.

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Dual Beam Ion Mill (Fischione Model 1010)

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Sputter Coater

Sputter Coater

  

  

 

  

  

Carbon CoaterCarbon Coater

  

  

  

 

 Ultrasonic Disk Cutter

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Dimpling Grinder (Fischione, Model 200)

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Vibratory Polisher

Vibratory PolisherVibratory polisher: •TEM specimens •Some unmounted specimens •Mounted specimens

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Specimen Sectioning

Precision Secting MachinePrecision sectioning machine Tceh Cut 5 from Allied

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  Low speed sectioning machine Tceh Cut 4 from AlliedPrecision Secting Machine

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 Metallography Polishing

One Manual Polishing Wheel, One Automatic Polishing Wheel •Central Pressure head •Pressure applied to whole fixture •Up to 6 mounts at once •Iultrasonic disk cutterndividual Pressure head •Pressure applied to each mount •Up to 3 mounts at once.  

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Vibratory Polisher

Vibratory PolisherVibratory polisher: •TEM specimens •Some unmounted specimens •Mounted specimens

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2 Multi Prep Polishers

Multi prep polishers2 MultiPrep Polishers: •TEM specimens •Unmounted specimens •Some mounted specimens 

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Metallography sample Preparation Tools

Hand GrinderHand Grinder:

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Belt GrinderBelt Grinder 

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Vacuum Impregnation and Epoxy CastingEpoxy casting Tools 

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MultiPrep Systems

The MultiPrep™ System enables precise semi-automatic sample preparation of a wide range of materials for microscopic (optical, SEM, TEM, AFM, etc.) evaluation. Capabilities multiprepinclude parallel polishing, precise angle polishing, and site specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill. The MultiPrep™ eliminates the need for hand-held polishing jigs, and ensures that only the sample makes contact with the abrasive.The MultiPrep is an excellent tool for precision cross-sectioning a wide variety of materials. Applications that take advantage of its speed, precision, and accuracy include failure analysis, yield analysis, quality control, and research & development. With feature size of certain samples becoming smaller, such as in the electronics industry, it is critical to control the material removal rate to avoid polishing through the area of interest. The MultiPrep provides consistent sample rotation, oscillation and load, assuring uniform material removal. The digital dial indicator allows the operator to observe how much material is being removed, in real time and in 1-micron increments. Many samples can be prepared unencapsulated on the MultiPrep, including IC die, electronic packages, PCB's, electronic components and other material systems.

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Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 11/3/14