Office: BI 1606
Dr. Lehman worked at Argonne National Laboratory Materials Science Division, for 6 years with extensive experience as TEM microscopist studying mechanical deformation in metals. He received his Ph.D. at the University of Notre Dame in 1986. Then he worked for IBM for 16 years. At IBM, he created a materials laboratory for the printer division in Endicott. Later he moved to the Thermal and Mechanical Analysis and Test group in the Microelectronics Division where he worked on many aspects of solder joining and packaging technology. During this period he became involved in the testing and evaluation of no-lead solder joints. Dr. Lehman holds 5 Patents and 14 Awards involving packaging and joining technologies. In 2001, Dr. Lehman joined the Research Foundation at Binghamton University. At BU he continues to study no-lead solders, including the nucleation and growth of the Sn phase and the resulting microstructures and crystallography. He has published or participated in several papers on these subjects. Dr. Lehman is currently the Laboratory Manager for the Small Scale Systems Integration and Packaging Center at Binghamton University.