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Program Title:
Electronics Packaging Symposium


The Integrated Electronics Engineering Center, a New York State Center for Advanced Technology, in conjunction with the Watson School Office of Engineering Professional Development, offers a 1.5 day annual symposium designed to promote the dissemination of emerging technologies in the area of electronics packaging technologies. The symposium focuses upon emerging technologies, thermal challenges, 3D packaging, sensors and MEMS, power electronics, packaging for harsh environments, emerging interconnect technologies, electronics miniaturization, and flexible/printed electronics. The symposium includes opportunities for networking and a student poster session.

Web Site:

Bill Infantolino, Associate Director
Tel: 607-777-4349

Binghamton University
The Integrated Electronics Engineering Center
P.O. Box 6000
Binghamton, New York 13902-6000