The CAMM was established in 2005 when the Flex Tech Alliance (formerly the United States Display Consortium) selected Binghamton University, a global leader in electronics packaging and small scale systems integration, in partnership with Endicott Interconnect Technologies Inc, and Cornell University, to spearhead development of next generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM brings together partners from government, industry and academia to tackle the myriad challenges of this emergent technology.
The mission of the Center for Advanced Microelectronics Manufacturing at Binghamton University is to demonstrate the feasibility of Roll-to-Roll (R2R) flexible electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low volume test bed products. R2R microelectronics manufacturing will be key to critical next-generation applications in myriad areas, such as medical diagnostics and treatment, military and homeland security, flexible displays and electronics, computer and telecommunications, and consumer products.
The CAMM's goals are to:
- map emerging flexible electronic technologies
- validate the design of flexible electronic manufacturing capabilities
- develop essential process technologies and manufacturing know-how
- demonstrate specific technologies and products through test-bed projects and low-volume device manufacturing.
More information is available on the CAMM presentation (.pdf, 5.1 MB)