The Center for Advanced Microelectronics Manufacturing (CAMM)
The Center for Advanced Microelectronics Manufacturing (CAMM), a partnership between Binghamton University (BU), Endicott Interconnect Technologies (EI), Cornell University and the Flex Tech Alliance, is the nation’s first prototype research and development (R&D) facility in large area flexible electronics. The CAMM is part of BU’s New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP), which serves as an international resource for systems integration and packaging R&D.
Our vision, to be an international leader in flexible electronics research and development, is enabled through our partnerships with government, academia and industry, which provide unique opportunities for collaboration to advance the development of next generation roll-to-roll (R2R) and printed flexible electronics manufacturing capabilities.
For additional information, please contact us at (607) 777-5314.