Bill Bernier

Dr. William E. Bernier

Research Professor of Chemistry and Materials Science
and Engineering

  • A.B., Chemistry, Brown University, Providence, RI
  • Ph.D., Analytical Chemistry, State University of New York
    at Binghamton, Binghamton, NY
  • MBA Certificate in Project Management, George Washington
    University, Washington, D.C.
Office:
Science 2 Bldg - Room 614
Phone:
607-239-9626
Fax:
607-777-4478
Email:
wbernier@binghamton.edu
 

Research Interests:

  • Materials and process development for Pb-Free semiconductor interconnection
  • Electronic circuit packaging
  • Nanotechnology
  • Energy storage technology
  • Materials and processes for device packaging for ultracapacitors and electrolytic capacitors

Recent Selected Publications

“Advanced Flip Chip Packaging”, ed. Ho-Ming Tong, Yi-Shao Lai, and C P Wong, Chapter 4 “Flip-Chip Interconnections – Past, Present & Future”, Sung-Kwon Kang, Da-Yuan Shih, and William E. Bernier, Springer, 2011

Last Updated: 6/25/14