Binghamton University has amassed a vast infrastructure for conducting energy efficient systems research by academic and industrial partners. Growth in this area will be enabled by a new $30M building, which will open in 2013. This building will have a 6000 square foot data center laboratory with different types of cooling facilities, supplemental solar power and an in-ground water battery. A 4000 square foot fully instrumented data center lab, supported in part by a NSF MRI award, is currently available for use by the center. This facility is equipped with 24 racks of IBM and Dell servers and will eventually be relocated to the new building. Technical expertise and infrastructure at the Integrated Electronics Engineering Center (IEEC) and Analytical and Diagnostics Laboratory (ADL) are maintained by Ph.D. level professional staff. Electronics packaging facilities at the (IEEC), a New York State Center of Advanced Technology, include an on-site demonstration facility that allows for rigorous and replicable testing of new technologies. Laboratories are equipped for analyzing electronics packaging technology products and are useful for performing physical, chemical, surface and electronic analysis of products and materials. Services include: measurement of material properties; design and reliability testing; and product analysis for determining manufacturing viability. Instrumentation includes: Thermal cycling chambers (4); Temperature and humidity chambers (3); Thermal shock chamber; HAST chamber; Shock tables (2); a JEDEC standard; Shaker table with oven; Material testing systems; Digital image correlation system; Shadow/cross sectional moiré; and Nano-indentation/AFM. The Analytical and Diagnostics Laboratory (ADL) is a $21M, 8,000 sq. ft. multiuser facility funded by New York State with the goal of enabling high technology commercialization for industry. Staffed with four Ph.D-level scientific staff, instrumentation available to researchers and partners includes FIB, TEM, thermal analysis tooling, SEM, AFM, confocal microscopy, X-ray diffractometry, and a micro-fabrication facility. Computer laboratories are extensively networked, wireless networked, and connected to Internet II. The Computer Science department has its own technical staff for maintaining the research equipment: Several large Dell Clusters (64 Dual-core, dual-CPU nodes), with 15K SCSI, 4 GB of RAM and 8 TBytes of external RAID (shared with other researchers), dual hex core servers with 48 GBytes of RAM, several 16-TByte RAID storage servers; 16 AMD Dual-Core workstations and 11 dual-CPU Xeon machines dedicated for exclusive use by the architecture research group led by the co-PIs; One 32 node, dual Xeon server cluster; and Several Quad-Core Xeon servers.
University of Texas at Arlington
An electronic cooling lab has equipment related to air cooling, complete with air flow bench and reliability equipment such as an Environmental Chamber, Instron Tester and Failure Analysis Capability. UTA is currently in the process of building two 500-square-foot data center lab facilities complete with two 20-ton CRAC units. The facility will be used to run various experiments related to the data center cooling technologies we plan to investigate. Several additional measurement laboratories with complete instrumentation are also located in the facility. A Stereo Particle Image Velocimetry (SPIV) system is housed at the Aerodynamics Research Center (ARC) and is available to carry out experimental flow visualization. Recently, a $145 million Engineering Research Lab was built. The facility provides approximately 234,000 square feet of space for state-of-the-art, multi-disciplinary research and teaching labs and classrooms, faculty and graduate student offices, administrative offices, conference rooms and support areas. ES2 at UTA plans to partner with UTA's Texas Manufacturing Assistance Center (TMAC), which regularly performs utilities assessments of regional companies to understand energy usage in operational facilities. A strong collaboration with UTA's Advanced Robotics Research Institute (ARRI), which engages in novel processes and tools for the assembly, packaging, and integration of manufacturable devices and systems at the microscale, will also be leveraged. Finally, The University of Texas at Arlington is home to the preeminent university-based nanotechnology research, development and teaching facility in north Texas. The Nanotechnology Research & Teaching Facility is an interdisciplinary resource open to scientists within and outside of the University. Research activities are conducted through mutually-beneficial associations of chemistry, electrical engineering, mechanical and aerospace engineering, materials science and physics faculty, graduate students and research assistants at UTA, as well as collaborative efforts with investigators at other universities and in the private sector. We plan to utilize the facility for fabrication related to 3D packaging/cooling.
The Villanova University Laboratory for Advanced Thermal and Fluid Systems (www.villanova.edu/latfs/facilities.html) is a modern, comprehensive laboratory for fundamental investigations in thermal transport and characterization of thermal management in electronics, energy, and propulsion systems. The laboratory houses several major facilities and many customized rigs. The Low Speed Boundary Layer Wind Tunnel is a versatile open-return wind with flow velocities up to 60 m/s and freestream turbulence of less than 1%. The Closed Return Aerodynamics Wind Tunnel is a commercial closed return wind with a cross section of 2 ft x 2 ft and flow velocities as high as 55 m/s or 120 mph in the test section. The Jet Impingement Facility is designed to provide clean, low-turbulence flow into a variety of nozzle configurations that are used to study the fluid mechanics and heat transfer in impinging jets for electronics cooling. A companion Spray Cooling Rig is a special apparatus designed to investigate the fluid mechanics and heat transfer due to spray and droplet cooling. A specialized Mini/micro Channel Flow Loop is a specialized liquid flow loop designed to deliver metered, constant temperature flow rate for investigation of single and multi-phase heat transfer in small scale heat exchangers for electronics cooling. The laboratory has many other custom rigs for measuring thermal properties such as thermal conductivity and thermal diffusivity, and for measuring the thermal impedance of interface materials. Diagnostic and measurement tools include thermal and particle imaging velocimetry, infrared imaging, ultra-high speed video, and liquid crystal thermal visualization.
Georgia Institute of Technology
The Microelectronics and Emerging Technologies Thermal Laboratory (METTL) houses fabrication and characterization facilities, as well as experimental rigs for the study of heat transfer and fluid flow phenomena from tens of nm to approximately m length scales. Characterization equipment includes infra-red microscopy, particle image velocimetry, high speed imaging, and temperature, pressure, and flow rate measurement capabilities over a broad range. Fabrication capabilities include wafer dicing, wire bonding, and nano-fabrication. Experiments at the rack level will be performed at the Consortium for Energy Efficient Thermal Management (CEETHERM) Data Center Laboratory which accommodates 28 computing racks arranged in a typical hot aisle cold aisle configuration. The data center infrastructure is designed to handle power densities of 500 W/sq.ft. Six computer room air conditioning units (CRAC) supply a total of 79,000 CFM of air, which provides cooling to the data center. A variety of cooling arrangements (under floor and overhead distribution) can be achieved with the four down flow and two up flow CRAC units. In addition, the facility has two air economizers which draw in cold ambient air during winter to reduce the cooling load on the chilled water system. In the economizer mode, the facility's digital control system performs a series of psychometric calculations to check if the conditions are conducive and accordingly commands the exhaust and economizer fans to draw in outside air. Power for the data center comes from a 480V, 1200A grid supply. The grid power branches into two panels that independently distribute power to the computing and cooling infrastructure in the data center. The power for the computing equipment is fed though three power distribution units that step down the voltage from 480V to 210V to power up the rack power strips. The data center has power monitoring capability installed at various levels from the incoming grid supply to the rack power strips. The data from the power meters and other data acquisition systems in the facility is logged into the PI software to generate PUE charts. Another major feature of the facility is the ability to conduct controlled studies (which usually cannot be performed in a large data center) in a simulated data center environment and compare it with an existing data center facility. This is achieved by splitting the facility into two equal sections using a collapsible insulted partition. The control system is designed such that each half has its own independent power monitoring, air flow distribution and economizer controls. This arrangement offers flexibility to validate the computational models and test the control algorithms on a smaller scale.