Dr. Agonafer is Professor and Director of the Electronics, MEMS & Nanoelectronics Systems Packaging Center which he founded when he joined UTA in 1999 after working 15 years at IBM. He currently advises 25 graduate students - 10 PhD's and 15MSc students (http://emnspc.uta.edu). Since joining UT Arlington in 1999, he has graduated 73 graduate students. His research at the UT Arlington center is multidisciplinary and focuses on a variety of research related to thermo/mechanical issues in Microelectronics, MEMS and Nanoelectronics with broad applications including computers, telecommunications and bio-fluidics.
In addition to a PhD program focusing in packaging, Professor Agonafer established a certificate program in packaging in fall 2001. The Certificate in Electronic Packaging program provides graduate-level knowledge in the field of electronic packaging, with a concentration on numerical and experimental characterization of thermo/mechanical issues.
Professor Agonafer has always been very active in professional society programs. He has been Guest Editor of special issues of The Journal of Electronic Packaging, The Journal of Heat Transfer, and IEEE’s Transactions on Components, Packaging, and Manufacturing Technology. He has published over 150 papers and has 8 issued patents. Since 2002, he has been a member of the “ASME Technical Executive Committee.” He was Editor in Chief, "Gordon and Breach Book Series in Electronic Packaging (1997-2000)," and has served as an Associate Technical Editor of the ASME Journal of Electronic Packaging. He is currently the Editor in Chief of ASME Press Book Series in Electronic Packaging and two books has since been published. From July 1997 - July 2000, he served as Chair of the ASME K-16 Committee in the Heat Transfer Division. He was Chair of the ASME Electrical and Photonic Packaging Division in 2000.
Professor Agonafer was the General Chair of InterPACK ’99 and ITHERM’96. Professor Agonafer serves on the Scientific Advisory Board of a NSF Center, Mid-Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007. He also serves on the Dean’s Engineering Advisory Committee at both University of Colorado and Howard University. Professor Agonafer is a Fellow of The American Society of Mechanical Engineers International (ASME) and Fellow of The American Association for the Advancement of Science (AAAS). In April 1998, Professor Agonafer was the recipient of the The University of Colorado School of Engineering Distinguished Engineering Alumni Award (DEAA) in the category of Research and Invention. In November 1998, he received The Howard University Distinguished PhD Alumni Award. Also, in November 1998, he received ASME K-16/EEPD Clock Award for Outstanding Contribution in Computer Aided Thermal Management of Electronic Packages. In 2002, he received ASME International Electronic and Photonic Packaging Division Highest Division Award for Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging. For the last 5 consecutive years, Professor Agonafer received an award from University of Texas at Arlington for having A strong record of external funding and scholarly achievement. Professor Agonafer received the Thermi Award at the 24th Annual Semi-Therm, March 2008, in San Jose, California. In July 2009, he delivered a keynote seminar in San Francisco as a recipient of the 2009 InterPACK Excellence Award. Professor Agonafer was at MIT as a Dr. Martin Luther King, Jr. visiting scholar September 1, 2007 – August 31, 2008.