Skip header content and main navigation Binghamton University, State University of New York - Ieec
 

Cover Photo 

Co-Chairs at 2012 Electronics Packaging Symposium

Co-Chair                                Organization                                   Co-Chair    Organization
Asif Chowdhury   ADI   Lei Fu   AMD
Bill Infantolino   Binghamton University   Mark Poliks   Endicott Interconnect
Dave Shaddock   GE Global Research   Martin Anselm   Universal Instruments
David Lin   GE Global Research   Junghyun Cho   Binghamton University
Emad Sammadiani   Binghamton University   Nancy Stoffel   GE Global Research
Howard Wang   Binghamton University   SB Park   Binghamton University
Jim Rose   GE Global Research   Shakti Chauhan   GE Global Research
Katie Rivera   IBM   Steve McKeown   BAE
Kaustubh Nagarkar   GE Global Research   Vivian Ryan   Global Foundries

 

Co-Chair:

Dave Shaddock, GE Global Research, Electronics Packaging Engineer

  Dave ShaddockDave Shaddock is an Electronics Packaging Engineer at the General Electric Global Research. He received a B.S.M.E. degree from Carnegie-Mellon University and M.S.Eng. Sci. in Microelectronics Manufacturing from Rensselear Polytechnic Institute. His research interests are in harsh environment electronics, thermal management, electronics manufacturing and reliability. He has 30 years of experience in electronics manufacturing and packaging at GE, Rockwell, and Motorola.
Co-Chair:

Bill Infantolino, Binghamton University, Associate Director IEEC

  Bill Bill Infantolino is the Associate Director of the Integrated Electronics Engineering Center at Binghamton University. He has over 30 years of experience in electronics packaging including nearly 25 years with IBM. He held a variety of engineering and management positions in the area of electronic packaging. The primary focus of his work was in the area of thermal and mechanical simulation and testing in support of product development, reliability evaluation, and solving manufacturing concerns. Bill also has held a variety of positions in laminate, module, and assembly product and process development. His experience spans a broad range of technologies in first level through system level packaging. Bill holds 11 patents in the area of electronic packaging and has over 15 papers published in journals and conference proceedings.
Co-Chair:

 David Lin, GE Global Research, Development Engineer

  David LinDr. David Lin joined the staff of GE Global Research in 2012. Prior to this, he was with Freescale Semiconductor Inc. and Discera Inc. as microsystem development engineer. His research work focuses on MEMS physical sensor design, modeling and reliability. Dr. Lin has 11 years industrial experience in MEMS inertial sensors and resonators research and development. He has successfully led multiple accelerometer and gyroscope development programs from novel concept generation into high volume production for both automotive and consumer applications. Dr. Lin has developed modeling techniques including multiphysics simulation, reduced order modeling and package MEMS co-simulation which enable high performance and high reliability inertial sensor design. Dr. Lin holds 10 issued U.S. patents, has 19 patent applications in process, and has published 12 technical papers. Dr. Lin is a member of Tau Beta Pi, Pi Tau Sigma and ASME.
Co-Chair:

  Emad Samadiani, Binghamton University, Visiting Research Assistant Professor

  EmadEmad Samadiani is a visiting research assistant professor at Binghamton University, working in Small Scale Systems Integration & Packaging Center. He received his PhD in Mechanical Engineering from Georgia Institute of Technology in August 2009. Before joining BU, he was a post-doctoral fellow at Georgia Tech. His research interests are in computational modeling methods for electronics thermal management systems from chip to data center level. He has co-authored over 15 journal and peer reviewed conference papers, one of which has received best-paper award from ASME.

Co-Chair:

Howard Wang, Binghamton University, Associate Professor of Materials
  WangProf. Howard Wang's research focuses on nanotechnology innovations for energy and electronics applications. His interdisciplinary research program integrates nanomaterials synthesis, characterization, processing and applications. His recent research activities include synthesizing metal nanoparticles, fabricating flexible sensors and transistors, formulating hybrid thermal interface materials for power electronics, and developing novel in situ neutron measurement techniques for studying electrochemical systems.

Co-Chair:

Kathryn Rivera, IBM, Development Engineer
  KathrynKatie Rivera is a thermal / mechanical packaging engineer in the IBM Systems & Technology Group. She received an B.S.M.E from Clarkson University and an M.S.M.E from Rensselaer Polytechnic Institute. She has 25 years experience in the design, assembly, fabrication, and test of electronic packages. Present focus is on evaluation and qualification of reliable thermal interface materials in electronic packaging.

Co-Chair:

Kaustubh Nagarkar, GE Global Research Center, Systems Engineer 
  KaustabhKaustubh R. Nagarkar is a Systems Engineer at GE Global Research Center in Niskayuna, NY. His research experience is in the areas of Sensors and systems for Healthcare, Solar PV packaging and reliability, high temperature thermoelectric assembly, and thermal management of electronics. He has 26 publications and 16 granted or filed patents. Kaustubh has a PhD ('06) in Systems Science with concentration in Electronics Manufacturing from Binghamton University. He is a member of ASME and IEEE. He serves as associate editor of the Journal of Electronic Packaging and is a member of the K16 Joint ASME committee on Thermal Management of Electronics.

Co-Chair:

Mark Poliks, Endicott Interconnect, Director of Research and Development
  mdpoliksMark D. Poliks is Director of Research and Development at Endicott Interconnect Technologies, Inc., (EI). He is also Technical Director of the Binghamton University based Center for Advanced Microelectronics Manufacturing (CAMM) and a Research Professor of Chemistry, Materials Science and Engineering at Binghamton.
Co-Chair:

Martin Anselm, Universal Instruments Corp, Manager, AREA Consortium

  MartinSince 2002 Martin has been working within Universal Instruments Corporation's Advanced Process Lab. He began his career in electronics Failure Analysis and began Managing the Failure analysis activities in 2006. In January of 2012 Martin was promoted to the Manager of the Advanced Research in Electronics Assembly (AREA) Consortium. Martin's surface mount assembly process knowledge and formal education in Mechanical Engineering, Materials Science, and Physics has given him a unique background for the determination of root cause in electronics. Martin has worked with some of the world's largest electronics manufacturers not only determining root cause, but to also implementing process, design, parts, and materials changes in order to improve end product quality, reliability, and manufacturability.
Co-Chair:

Junghyun Cho, SUNY Binghamton University, Associate Professor

  ChoDr. Junghyun Cho is currently an Associate Professor, a Director of Graduate Studies in the Department of Mechanical Engineering, and a Director of the Materials Engineering Program at the State University of New York (SUNY) at Binghamton. He joined the University as an Assistant Professor in Fall 2001 after finishing a postdoctoral research appointment at the University of California, Santa Barbara. He received his B.S. in Metallurgical Engineering from Yonsei University (Seoul, Korea) in 1991, M.S. in Materials Science and Engineering from Northwestern University in 1993, and Ph.D. in Materials Science and Engineering from Lehigh University in 1998. Before starting his graduate studies, Dr. Cho had worked at Samsung Semiconductor R&D Center (Kihung, Korea) in the area of electronics packaging materials and processes (1990-91). His research interests include microstructure design and characterization of materials, ceramic thin films, processing science, and mechanical behavior of materials.
Co-Chair:

 Nancy Stoffel, GE Global Research, Manager of the Advanced Packaging Fabrication and Processes Group

  Nancy StoffelDr Nancy Stoffel is the manager of the Advanced Packaging Fabrication and Processes Group at GE Global Research. Prior to joining GE, Nancy was the Director of Microsystems Packaging at the Infotonics Technology Center. She also worked at, Xerox, and IBM in the areas of materials and process development for microsystems and electronic packaging. Nancy's education includes a PhD from Cornell in Materials Science, an MS in chemical engineering from Columbia University, and a BS from The University of Virginia, also in chemical engineering.
Co-Chair:

Stephen Mckeown, BAE Systems, Chief Mechanical Engineer

  StephenMr. McKeown has 35 years of experience in the analysis of electronic packaging since graduation from Rensselaer Polytechnic Institute with BSME and M.EngME degrees. He is the author of Mechanical Analysis of Electronic Packaging Systems (Marcel-Dekker, 1999) and holds several US patents. He is an associate editor of the ASME Journal of Electronic Packaging.
Co-Chair: 

 Vivian Ryan, GlobalFoundries, Senior Member of Technical Staff

  Vivian RyanDr Vivian Ryan received her PhD in experimental physics from Stevens Institute of Technology. She was a Principal Investigator in Biophysics at the National Institutes of Health before joining AT&T Bell Labs. At Bell Labs she worked in R&D on novel thin film materials for microelectronic applications, next-generation ULSI technology platforms, and advanced packaging concepts. She is currently a Senior Member of Technical Staff at GLOBALFOUNDRIES Albany Nanotech Center for Semiconductor Research where she conducts research on chip-package interactions and next-generation metallization. Vivian has over 30 US patents.
Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 4/26/13