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Confirmed Presenters at 2014 Electronics Packaging Symposium

Speaker   Organization

Azemar, Jerome


Araujo, Ken


Bottoms, Bill

  Third Millennium Test Solutions

Castracane, James


Chaney Richard

  American Semiconductor

Chiang, Shiuh-Kao


Egitto, Frank

  i3 Electronics

Ellsworth, Mike


Fleischer, Amy


Garner, Sean


Huffman, Alan


Iyer, Subramanian


Kandlikar, Satish


Lee, Ning-Cheng

Lee, Kangwook   Tohoku University

Li, Tao

  University of Michigan

Liu, Weiping


Macdonald, Eric

  University of Texas - El Paso

Marconnet, Amy


McCluskey, Pat

  University of Maryland

Okabe, Hiroyuki



Patti, Bob



Polinsky, Bill 


MS Kennedy

Poole, Neil



Rae, Alan


Alfred Technology Resources

Ready, Steve



Schoeller, Harry



Shaddock, Dave


GE Global Research

Shorey, Aric


Smukowski, David

  Sensors in Motion

Spadaccini, Chris


Lawrence Livermore National Lab

Woychik, Chuck



Yamada Tomoyuki




Speaker: Wilmer R. Bottoms, Third Millennium Test Solutions
Abstract: A Revolution in Packaging Driven by the Internet of Things and Migration to the Cloud

Dr. Wilmer Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures.
Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries. Among these companies are: APMT, Business Insurance Company, Chevy's Mexican Restaurants, Credence Systems, Johnny Rockets, Microelectronics Packaging Inc., NanoNexus, SBA Material,  Southwest NanoTechnologies, Tessera, Third Millennium Test Solutions.He has also served on government committees including the Board on Assessment for the National Institute for Standards and Technology and the Technical Advisory Committee to the Export Control Commission. Dr. Bottoms currently serves as:

  • Emeritus Member of the Board of Tulane University
  • Chairman of the Technical Working Group for Assembly and Packaging for the International Technology Roadmap for Semiconductors
  • Chairman of the Technical Working Group for Packaging and Component Substrates for the International Electronics Manufacturing Institute
  • Chairman of the Semiconductor Equipment and Materials International's SEMI Awards Committee
  • Chairman of APMT
  • Chairman of Third Millennium Test Solutions"
Speaker: James Castracane, CNSE
Abstract: Integrating the Animate and Inanimate Worlds: IC Fabrication Methods for Bio Applications
  Dr. Castracane is Professor (Founding Faculty) and Head of the Nanobioscience Constellation in the College of Nanoscale Science and Engineering (CNSE) at the University at Albany-SUNY. Dr. Castracane received his BS degree in Physics from Canisius College (1976) and his Ph.D. in Physics from The Johns Hopkins University (1982). Dr. Castracane has received research funding from numerous Federal agencies including NIH, NSF, DOD, DOE, DARPA, and NASA as well as a significant portfolio of State and corporate sponsors. His publication record spans over 150 articles, numerous invited or keynote presentations and 14 patents issued/pending.Prior to joining CNSE in 1998, Dr. Castracane's private sector experience involved positions at high technology R & D companies including Chief Operating Officer at InterScience, Inc. from 1994-98. As Director of the New York State Center for Advanced Technology in Nanomaterials and Nanoelectronics from 2004-2009, Dr. Castracane continued to assist in the development of the business potential of numerous companies through technical interactions and management consulting.
Speaker: Shiuh-Kao Chiang, Prismark
  Dr. Shiuh-Kao Chiang has a B.Sc. degree in Materials Science and Engineering from National Tsing Hua University in Taiwan, R.O.C., a M.S. degree in Metallurgical Engineering from University of Notre Dame, a Ph.D. in Ceramic Engineering from Ohio State University, and an Executive MBA degree from Cleveland State University.Shiuh-Kao's past experience includes material characterization, new product and process development, R&D management and technical marketing. Shiuh-Kao holds several patents, awards, and publications in electronic material, packaging, and processing areas. He joined Prismark in February 1998.Dr. Shiuh-Kao Chiang is responsible for the development of Prismark's business in Asia, as well as the management of research projects and services in Japan, Taiwan, China, Korea, Singapore, and other Asian countries. Over the past 15 years, Prismark has developed business and service relationships with most of the leading electronics, semiconductor, packaging, assembly, PCB and material companies in Asia. In addition, Prismark has also extended its services to leading financial institutions to assist their investments in Asia."
Speaker: Frank D. Egitto, i3 Electronics
Abstract: Miniaturization for Flexible and Flexible-Hybrid Electronics Applications
  Frank D. Egitto is Director of Research and Development at i3 Electronics, Inc. in Endicott, NY. His area's activities focus on materials, equipment, design, and process development for fabrication of high-density flexible circuitry, semiconductor packaging, and printed wiring boards. He holds B.A. and M.A. degrees in physics from Binghamton University and has over thirty-six years of experience working in the microelectronics industry. He is author or coauthor of 8 book chapters and over 80 technical papers, and holds 87 US patents.
Speaker: Mike Ellsworth, IBM
Abstract: Liquid (Water) Cooling Today's High Performance Computers
  Mr. Ellsworth, a Senior Technical Staff Member with IBM in Poughkeepsie, NY, is currently the thermal lead for the water cooled pIH Supercomputing System and its follow-ons. He received his B.E.M.E. (1984) and M.E.M.E. (1988) from Manhattan College in Riverdale, NY. While at IBM he has explored improved thermal management for applications ranging from laptops to high-end servers and has investigated thermal technologies encompassing air, water, and refrigeration. He is a member of ASHRAE and IEEE, and is also a Fellow of ASME where he served on the Electronics and Photonics Packaging Division Executive Committee and on the K-16 Committee on Heat Transfer in Electronic Equipment. He has authored or co-authored more than 30 technical papers and is a co-inventor on nearly 170 US patents.
Speaker: Amy Fleischer,Villanova
Abstract: The Recovery and Reuse of Waste Heat in Data Centers
  Dr. Amy Fleischer is a Professor of Mechanical Engineering at Villanova University where she is also Associate Chair of Mechanical Engineering and Director of Graduate Studies. She heads the NovaTherm Research Laboratory where her research interests include the broad topics of sustainable energy system design and thermal management of electronic systems. Recent research projects have included development of nano-enhanced materials, energy storage in phase change materials, and waste heat recovery from data centers. Dr. Fleischer is recognized as an expert in thermal-fluid system design and was elected by her peers as Chair of the ASME Technical Committee on Electronics Thermal Management (2009-2011). She has received numerous awards from her peers including the "2010 ASME EPPD Women Engineer of the Year Award" which recognizes a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. She was also the recipient of the 2011 ASME K-16 Clock Award for "Outstanding and continuing contributions to the science and engineering of heat transfer in electronics."Amy is an Associate Editor of the Journal of Heat transfer, a past AE of the Journal of Electronic Packaging, the author of numerous technical peer reviewed papers, and has edited one book. 
Speaker: Sean Garner, Corning
Abstract: Ultra-Slim Flexible Glass for Optical and Electronic Applications
  Sean Garner received a B.Eng. degree in Engineering Physics (Applied Laser and Optics) from Stevens Institute of Technology in 1993 and a Ph.D. in Electrical Engineering (electrophysics) from the University of Southern California in 1998. In 1998, Sean began his career at Corning Incorporated, working in the area of materials processing and device prototyping at the company's Science and Technology Center.
Speaker: Alan Huffman, RTI
Abstract: 2.5D and 3D Technologies and Applications at RTI International
  Alan Huffman is a Research Engineer and Program Manager for wafer level packaging technologies with the Electronics and Applied Physics Division at RTI International. He received the Bachelor of Science in physics from the University of North Carolina - Chapel Hill in 1994 and joined the former MCNC - Research and Development Institute thereafter. From 1994 to 2005 he was a Member of the Technical Staff at MCNC-RDI working on the development and implementation of flip chip technologies, reliability and failure mode analysis of flip chip devices, and optoelectronic and MEMS packaging. In 2005 he joined RTI International after their acquisition of the MCNC-RDI research groups. His current work focuses on wafer level packaging technologies, characterization of polymers and other materials for WLP applications and 2.5D interposer and 3D integration technologies. He has authored or co-authored numerous papers, articles, and presentations on a number of advanced interconnect and packaging topics. Alan is a Senior Member of IEEE and a member of the IEEE CPMT and IMAPS societies.


Steve Ready,PARC
Abstract: Printing of Multi-Functional 3D Objects
  Steve Ready obtained his degree in Physics from the University of California at Santa Cruz. He then joined Xerox Palo Alto Research Center and has since studied the role of hydrogen in amorphous, polycrystalline and crystalline silicon and has contributed to the development of large area amorphous and polycrystalline silicon imaging arrays for optical and x-ray applications. Recently he has designed and developed several high-accuracy inkjet printers for printed organic electronics and documents.


Dave Shaddock, GE Global Research
Abstract: High Temperature Laminate Characterization
  Dave Shaddock is an Electronics Packaging Engineer at the General Electric Global Research. He received a B.S.M.E. degree from Carnegie-Mellon University and M.S.Eng. Sci. in Microelectronics Manufacturing from Rensselear Polytechnic Institute. His research interests are in harsh environment electronics, thermal management, electronics manufacturing and reliability. He has 30 years of experience in electronics manufacturing and packaging at GE, Rockwell, and Motorola.
Speaker: Aric Shorey, Corning
Abstract: Through Glass Via Substrates: Technology, Performance and Applications
  Aric Shorey has been Commercial Technology Manager for the Semiconductor Glass Products program at Corning, Incorporated since 2011. He has BS/MS in Mechanical Engineering and a PhD in Materials Science – all from the University of Rochester. He has spent the majority of his career leading development activities in material's characterization, precision finishing and metrology for the telecommunications, precision optics and semiconductor industries.
Speaker: Satish Kandlikar, RIT
Abstract: Recent Advances in Pool and Flow Boiling for Electronics Cooling
  Satish Kandlikar is a Gleason Professor of Mechanical Engineering at Rochester Institute of Technology. His areas of expertise include high flux electronics cooling, cold plates, fuel cells, pool and flow boiling and microchannel heat transfer and microfluidics. He has published over 350 journal and conference papers. He has received a number of awards including the ASME 2012 Heat Transfer Memorial Award.
Speaker: Kang-Wook Lee, Tohoku University
Abstract: 3D Hetero-Integration Technologies for Innovative Convergence Systems
  Kang-Wook Lee received the Ph.D. degree in machine intelligence and systems engineering (currently bioengineering and robotics) from Tohoku University, Sendai, Japan, in 2000. From 2000 to 2001, he was an engineer for Japan Science and Technology Corporation, Sendai, Japan. From 2001 to 2002, he was a postdoctoral researcher for Rensselaer Polytechnic Institute, Troy, New York, USA. From 2002 to 2008, he worked at Memory Division, Samsung Electronics Ltd., Korea, as a principal engineer. He joined to Tohoku University as a faculty in 2008 and currently with New Industry Creation Hatchery Center, Tohoku University, as a Professor. he has published more than 170 technical articles. He is a IEEE Senior Member.
Speaker: Dr. Tao Li, University of Michigan
Abstract: Sub-Millimeter Packages for Microsystems in Harsh Downhole Environments
  Dr. Tao Li is an Assistant Research Scientist (research faculty member) in the Department of Electrical Engineering and Computer Science at the University of Michigan, Ann Arbor. He is also a faculty member with the Center for Wireless Integrated MicroSensing and Systems (WIMS2) at the University of Michigan. He received the B.S. and M.S. degrees in engineering from Tsinghua University, China, and Ph.D. in Electrical Engineering from the University of Michigan, Ann Arbor in 2009. His research interests include micromachined sensors and actuators, sensor interface and embedded systems, CMOS electronics, microsystem packaging, and traditional Si-based and nontraditional microfabrication technologies. He has about 30 journal and conference publications and 4 patents issued or pending.
Speaker: Eric MacDonald, University of Texas - El Paso
Abstract: 3D Printing Multi-Functionality: Mechanical Structures with Electronics and Electromagnetics
  Eric MacDonald, Ph.D. is the Texas Instruments Endowed Professor in the Department of Electrical and Computer Engineering and associate director of the W. M. Keck Center for 3D Innovation at the University of Texas at El Paso. Dr. MacDonald received his B.S. (1992), M.S. (1997) and Ph.D. (2002) degree in Electrical Engineering from the University of Texas at Austin. He worked in industry for 12 years as a chip designer until 2002 working at IBM and Motorola. He co-founded a start-up - Pleiades Technologies, Inc. - specializing in self-test circuitry and CAD software. The company was acquired by Magma Inc. San Jose, CA. Dr. MacDonald joined UTEP in 2003 and has held faculty fellowships at NASA's Jet Propulsion Laboratory, the Office of Naval Research and a Fulbright Fellowship in Chile. His research interests include 3D printed electronics, ultra-low power chip design and electronics for harsh environments. Recent projects include 3D printing of structures like nano satellites with electronics in the structure (one of which was launched into Low Earth Orbit in late 2013 and a replica of which is on display at the London Museum of Science), bio-medical devices and 3D sensor systems. He has over 40 referred publications, three patents (one of which was licensed by Sony from IBM) and has taught over a thousand graduate and undergraduate engineering students.
Speaker: Amy Marconnet, Purdue
Abstract: Nanoengineering Materials for Heat Dissipation
  Amy Marconnet is an assistant professor of Mechanical Engineering at Purdue University. She received a B.S. in Mechanical Engineering from the University of Wisconsin – Madison in 2007, and an M.S. and a PhD in Mechanical Engineering at Stanford University in 2009 and 2012, respectively. She then worked briefly as a postdoctoral associate at the Massachusetts Institute of Technology, before joining the faculty at Purdue University in 2013. Research in the Marconnet Thermal and Energy Conversion Lab (M-TEC) integrates metrology and analysis of underlying transport mechanisms with design and development of nanostructured materials for heat transfer and energy conversion applications.


Patrick McCluskey, Associate Professor of Mechanical Engineering, University of Maryland
  Dr. Patrick McCluskey (Ph.D., Materials Science and Engineering, Lehigh University) is an Associate Professor of Mechanical Engineering at the University of Maryland, College Park, where he conducts research at the Center for Advanced Life Cycle Engineering (CALCE) in the areas of thermal management, reliability, and packaging of electronic systems for use in extreme temperature environments and high power applications. Dr. McCluskey has published more than 90 refereed technical articles on these subjects, and has edited three books. He has also served as technical chairman for multiple international conferences and workshops. He is an associate editor of the IEEE Transactions on Components, Packaging, and Manufacturing Technology, a fellow of the International Microelectronics and Packaging Society (IMAPS), and a member of ASME, IEEE, and SAE.
Speaker: Hiroyuki Okabe, Shando
Abstract: High Performance Flex Substrate for LED / Optical Transmission
  Hiroyuki Okabe is a deputy Director in Package Materials Production Division of Shindo Electronics, responsible for business development with TAB/COF related technologies.He joined Shindo in 2013 through the acquisition of the division from Hitachi Cable. He worked for over 25 years in the company where he mainly managed development and design engineering of TAB/COF applications and technologies.He received B.E. degree in Applied Chemistry from Waseda University (Japan) in 1987.
Speaker: William Polinsky, MS Kennedy
Abstract: High Temperature Hybrid Microcircuit Challenges
  William Polinsky has been with the MS Kennedy since 2007 and has served as High Temperature Product Line / Business Development Manager since February 2012 and Ceramics Group Product Line Manager from November 2007 until February 2012. From 1998 to 2007, Mr. Polinsky served Micron Technology in a variety of semiconductor fabrication and device packaging positions beginning with Process Engineer and ending with Engineering Manager. Mr. Polinsky holds a Bachelor of Science in Electrical Engineering from Rochester Institute of Technology, and a Master's in Business Administration from the Walden University.
Speaker: Chuck Woychik,Invensas Corporation
Abstract: Advanced Interconnectology for Next Generation Mobile Devices
  Charles Woychik is Senior Director of 3D Technology for Invensas Corporation™, a San Jose based leader in semiconductor packaging and 3DIC technology []. He currently has been with the company for 4 years. Prior to Invensas, Chuck worked 5 years for General Electric Global Research, after spending the first 18 years of his career with IBM. His area of expertise is materials and processes for electronics packaging. He holds a doctorate and Masters of Science degree in Materials Science and Engineering from Carnegie-Mellon University. He has a Bachelor's of Science degree in Materials Science from the University of Wisconsin, Madison. Chuck has numerous publications and 54 issued US patents to his credit.
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Last Updated: 9/16/14