Summary of 2011 Electronics Packaging Symposium
The Integrated Electronics Engineering Center a New York State Center of Advanced Technology at Binghamton University, part of The New York State Center of Excellence in Small Scale Systems Integration and Packaging, in conjunction with GE Global Research Center and the Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 2011 Electronics Packaging Symposium, Technology Advances in Small Scale Systems and Microelectronics Packaging, October 10-11, 2011 at Binghamton University.
The symposium provided over 150 attendees from academia, government and industry with information about promising new technologies and developments that are now impacting the electronics industry. Participants received overviews and research reports on a range of emerging technologies including: National Trends, Thermal Management, 3-D Packaging, Sensors/MEMs, Power Electronics, Packaging for Harsh Environments, Interconnects, Miniaturization, and Flexible/Printed Electronics.
The symposium was opened by Bahgat Sammakia, Interim Vice President for Research, and Jerry Trant, GE Global Technology Leader, Micro & Nano Structure Technologies. Speakers included:
|Tien Wu, Chief Operating Officer, ASE
|| Rob O'Reilly, Analog Devices
|Terry Ericsen, Office of Naval Research
|| S. Manian Ramkumar, RIT
|Klaus Hummler, SEMATECH
|| Liangyu Chen, NASA
|Brandon Prior, Prismark Partners
|| Roger Quon, SEMATECH
|Madhu Iyenagar, IBM
|| Tan Zhang, GE Global Research Center
|Yifan Guo, Skyworks Solutions, Inc.
|| Lei Fu, AMD
|Emad Samadiani, Binghamton University
|| Gamal Refai-Ahmed, PreQual Tech Corp.
|Bernd Appelt, ASE Group
|| Wayne Jones, Binghamton University
|Shakti Chauhan, GE Global Research
|| Joseph Fjelstad, Verdant Electronics
|Michael Gaynes, IBM TJ Watson Research Center
|| Romeo Delrosario, Army Research Laboratory
|Carl Raleigh, Analog Devices
|| Liang Yin, Universal Instruments
|Sang Won Yoon, Toyota Research Institute of NA
|| Kock-Yee Law, Xerox
|Ralf Lenigk, GE Global Research
|| Yongjae Lee, GE Global Research
|Jared Hornberger, APEI
|| Mark Poliks, Endicott Interconnect Technologies
|Andrew Oliver, WIMS, University at Michigan
|| Brian Roggeman, Universal Instruments
|Patrick McCluskey, University of Maryland
Dinner remarks were given by Steve Betza Corporate Director, Electronics Engineering and Packaging, Lockheed Martin.
The next symposium is scheduled for Fall, 2012 at GE Global Research, Niskayuna, NY.