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Summary of 2012 Electronics Packaging Symposium 

 2011_summary

 

The symposium provided 150 attendees from academia, government and industry with information about promising new technologies and developments that are impacting the electronics industry. Participants received research reports on a range of emerging technologies including: Technology Advances, Thermal Challenges, 3-D Packaging, Sensors/MEMs, Power Electronics, Packaging for Harsh Environments, Emerging Interconnect Technologies, Handheld/Miniaturization, and Flexible/Printed Electronics.

The symposium was opened by Bahgat Sammakia, Binghamton University Vice President for Research, and
Jerry Trant, GE Global Technology Leader, Micro & Nano Structure Technologies. Speakers included:

                                                         

Raj Jammy, SEMATECH Nathan Gill, BAE Systems
Avram Bar-Cohen, DARPA/ University of Maryland Arun Gowda, GE
Peter Brofman, IBM Patrick McCluskey, University of Maryland
Mark Christensen, Prismark Partners Hongwen Zhang, Indium Corporation
Hendrik Hamann, IBM Pedro Quintero, University Puerto Rico-Mayaquez
Kamal Sikka, IBM Liang-Yu,Chen, NASA
Yogen Utturkar, GE Evan Colgan, IBM
David Altman, Raytheon Shan Gao, Global Foundries
Pol Marchal, IMEC Brian Sapp, SEMATECH
Urmi Ray, Qualcomm James, Lu, RPI
Satish Chaparala, Corning Incorporated Alfred Zinn, Lockheed Martin
Paul Franzon, NCSU Sean Garner, Corning Incorporated
Marc Papageorge, Icintek Jim Watkins, University of Massachusetts
Jeremy Muldavin, MIT Lincoln Labs Barry Ives, MC10, Inc,
Rolf Aschenbrenner, Fraunhoffer John Keech, Corning Incorporated
Yong Liu, Fairchild Semiconductor Corp. Charles Woychik, Invensas Corporation
Luc Frechette, University de Sherbrooke Rabindra Das, Endicott Interconnect Technologies
Bin Yu, SUNY Albany Subhash Sinde, Sandia National Labs

Lunch remarks were provided by Shekhar Borkar, Intel. Dinner remarks were given by Ljubisa Stevanovic, GE.

The next symposium is scheduled for fall, 2013 at Binghamton University, Binghamton, New York.

 

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 3/28/14