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2013 Electronics Packaging Symposium 

October 15-16, 2013




The Integrated Electronics Engineering Center, a New York State Center for Advanced Technology at
Binghamton University, part of The New York State Center of Excellence in Small Scale Systems Integration
and Packaging, in conjunction with GE Global Research Center and the Binghamton Chapter of the IEEE
Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 2013 Electronics
Packaging Symposium, Technology Advances in Small Scale Systems and Microelectronics Packaging,
October 15-16, 2013 at Binghamton University, Binghamton, NY.

The symposium provided over 200 attendees from academia, government and industry with information about
promising new technologies and developments that are impacting the electronics industry. Participants
received research reports on a range of emerging technologies including: Technology Advances, Thermal
Challenges, 3-D Packaging, Sensors/MEMs, Power Electronics, High Temperature Electronics, Medical
Electronics, Handheld/Miniaturization, and Flexible/Printed Electronics.

The symposium was opened by Bahgat Sammakia, Binghamton University Vice President for Research, and
Jerry Trant, GE Global Technology Leader, Micro & Nano Structure Technologies. Speakers included:


Raj Master, Microsoft Corporation Kanad Ghose, Binghamton University
Gary Calabrese, Corning Global Research HongWen Zhang, Indium Corporation
Bill Trueheart, Lockheed Martin Laleh Rabieirad, Blue Highway, Inc.
Brian Swiggett, Prismark Partners Patrick McCluskey, University of Maryland
Suresh Sitaraman, Georgia Tech Ravi Bhatkal, Alpha
Ken Goodson, Stanford University Junghyun Cho, Binghamton University
Milnes David, IBM Ivy Quinn, K&S
Paul Franzon, NC State University Chad O'Neal, APEI
Alfonso Ortega, Villanova University Ou Li, ASE US
Charles Woychik, Invensas Corporation John DeFranco, Orthogonal, Inc.
Peter DeBock, GE Global Research Celeste Fralick, Intel Corporation
Michael Zylinski, Analog Devices Christine Kallmayer, Fraunhofer Institute
Arthur Russell, Vicor Corporation Russell Shumway, Amkor Technologies
Dana Weinstein, MIT Ioannis (John) Kymissis, Columbia University
Marc Coq, IBM Alain Guery, Analog Devices
Eric Pabo, EV Group Mitul Dalal, MC10
Dan Maslyk, Henkle Electronic Materials LLC William Grande, Micropen Technologies
Jason Gorman, NIST  

The dinner speech was given by Nathan Gnanasambandam, Xerox Corporation.

The next symposium is scheduled for fall, 2014 at Binghamton University, Binghamton, New York.


Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 3/28/14