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2014 Electronics Packaging Symposium

Technology Advances in Small Scale Systems and Microelectronics Packaging 
at Binghamton University in Binghamton, NY 
October 8 & 9, 2014

New, Expanded Conference Facilities

 


 

Presented By

The Integrated Electronics Engineering Center (IEEC), A New York State Center for Advanced Technology at Binghamton University and part of The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3iP)

 

In Conjunction With

GE Global Research Center and Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT)

 
The symposium will focus on promising new technologies and developments that are now impacting the electronics industry. Participants will receive overviews and research reports on a range of emerging technologies in the areas of:
  • Embedded Electronics
  • Thermal Challenges
  • 3D Packaging
  • Sensors/MEMs
  • Flexible Electronics
  • High Temperature Electronics
  • Mobile Electronics
  • Printed Electronics/Additive Manufacturing

 

Program Overview

Small scale microelectronics technologies are finding applications in an ever widening array of products. Among the most exciting developments are those in the micro and nanoscale area. Researchers working at or near the molecular level have recently made significant breakthroughs that will enable companies to create entirely new products, applications, and highly efficient manufacturing techniques. Applications for these technologies include: biomedical devices, diagnostic equipment, medical/surgical applications, telecommunications, aerospace, optical data storage and transmission, military observation, detection and communications, and a wide range of commercial applications. Many of these applications require products to perform in harsh environments where they must withstand thermal stresses, vibration and shock. As a result, there has been a great deal of research and innovation concerning robust design and the selection of novel materials. Some of the most spectacular developments in electronics packaging are now beginning to take shape.

The symposium will focus on providing the attendees with information about promising new technologies and developments that are now impacting the electronics industry. Participants will receive overviews and research reports on a range of emerging technologies including: National Trends, Embedded Electronics, Thermal Challenges, 3D Packaging, Sensors/MEMs, Flexible Electronics, High Temperature Electronics, Mobile Electronics, and Printed Electronics/Additive Manufacturing.

 

Who Should Attend

The program will be of particular value to: development engineers, technical managers, researchers, application specialists, and strategic planners from industry, universities and government laboratories. There will be a special segment of keynote presentations providing a broad overview of recent developments in several areas vital to small scale systems and microelectronic packaging.

 

Why You Should Attend

This symposium is strategically critical to you if you are involved in the development or manufacture of electronics products, applied research, or in charting the direction of your organization. This program will provide you with both basic knowledge and insight into many promising applications and product opportunities for small scale systems packaging technologies. This program also prepares one for follow-on technical programs that address more in-depth aspects of technologies being used in the design of small scale packaging technologies. For those in the research arena, this program will provide an update on the latest developments and provide additional opportunities for professional networking and collaboration.

 

Objectives

This symposium provides an overview of several emerging technologies that represent business and product opportunities that will drive many new technology applications. The ten major segments of this symposium provide both a technical overview of selected technologies and also new applications that have been developed. The sessions provide technical briefings on several exciting new small scale packaging technologies. Armed with this knowledge, participants will be able to examine their own products and operations to see where selected technologies can be integrated. They will also be able to participate in follow-on technical vitality lectures which will be available via Watson School distance learning programs. Follow-on symposia will address engineering and design issues for various application areas to enable companies to apply new technologies to their own products. Upon completion of this program, the participant will have gained:

 

Contact Information

Bill Infantolino
Associate Director
The Integrated Electronics Engineering Center Binghamton University
binfanto@binghamton.edu

Kaustubh Nagarkar
Senior Engineer
GE Global Research
nagarkar@ge.com

 

Continuing Education Units (CEUs)

This program carries 1.5 CEU credits for participation. CEU credit forms will be available at the program.

 

Schedule

We will send directions with your confirmation packet. You may also check the Travel Section of the website for maps and directions.

7:30 a.m. - 8:00 a.m. Registration and continental breakfast
8:00 a.m. - 4:30 p.m. Program
4:30 p.m. - 5:50 p.m. Poster Session and Reception 
5:50 p.m. - 8:10 p.m. Dinner / Dinner Speaker

7:30 a.m. - 8:00 a.m. Continental breakfast
8:00 a.m. – 11:40 a.m. Program
11:40 a.m. – 12:40 p.m. Optional lunch
12:40 a.m. – 2:40 p.m. Optional lab / facilities tours       

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 3/28/14