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2.5D & 3D Packaging Workshop

Enabling Pervasive System Integration through 2.5D & 3D Packaging

October 8th & 9th 1:00 pm - 6:30 pm

Binghamton University, Binghamton NY

In conjunction with the Electronic Packaging Symposium

Workshop Jointly Sponsored by Binghamton University & IEEE CPMT Society

 

 

Abstract

Development of 2.5D & 3D packaging technologies towards heterogeneous integration has drawn a high level of attention throughout the entire electronic industry.  To date, the driving force has been high bandwidth memory-processor integration, especially for consumer and mobile applications.  While the implementation timeline of true 3D packaging with TSV technology has been extended for many applications, implementations of innovative solutions enabled by interposers (2.5D) appear to be imminent.  How are these technologies applicable in other markets, including electronic systems in the aerospace and defense industries?  Indeed "More Moore and More than Moore" are the enabling driving forces for pervasive electronic system integration.  Further, electronic packaging technology innovation will play a key role in realizing more highly integrated, high performance, compact electronics systems.

This workshop is organized for a critical look at the ecosystem for a 2.5D and 3D packaging roadmap to enable and support pervasive electronic system integration. The goal is to identify the critical technologies and applications as well as map out the critical path, challenges, etc. related to developing the ecosystem to move forward.

 

This Workshop is organized in conjunction with the Binghamton University Electronic Packaging Symposium and jointly sponsored between Binghamton University and the IEEE CPMT Society Binghamton Chapter. The plan is to provide a forum for experts from industry, government and academia to discuss the technical issues and challenges for the road ahead.

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 8/8/14