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Co-chairs at 2014 2.5D / 3D WORKSHOP

Speaker   Title   Organization

Dan Blass


Ron Nowak.

  Staff Product Design Engineer   Lockheed Martin MST Owego

Mark Poliks.

  Professor, SSIE   Binghamton University

Bill Chen

  Fellow and Senior Technical Advisor   ASE

James Libous

  IEEE Fellow   Lockheed Martin Corporate Engineering & Technology

Jim Wilcox.

      CPMT - Binghamton



Speaker: Ron Nowak, Staff Product Design Engineer, Lockheed Martin MST Owego
  Ron Nowak started his career with IBM in 1979 where in he worked in design engineering of high speed cable, connector and backplane interconnects for high end servers. His work in Endicott helped the Microelectronics division build and grow their high performance semiconductor packaging business as IBM evolved into the merchant market world during the mid 1990s. This included the Application Engineering and Program Manager role enabling customers to analyze, design, and build their leading their edge ASIC package platforms with a new organic high performance, high reliability materials.

At IBM, he co-developed their most advanced organic high performance PTFE based semiconductor package, HyperBGA, whose patent ranked in the top 5 percent of IBM's portfolio for more 3 years. Mr. Nowak also ran the application engineering and design automation team at Endicott Interconnect Technologies. There he helped build an entire new market presence for their packaging portfolio with many new DoD and military customers. During this timeframe, he drove the creation of an entirely new product line for System in Package (SiP), releasing hundreds of new designs into manufacturing. He was hired in 2011 by Lockheed Martin in Owego as a Product Design Engineer. Mr. Nowak has a BS in Applied Physics from Binghamton University. He resides in Vestal, NY with his wife Kathy and family.

 Speaker:   Bill Chen, Fellow and Senior Technical Advisor, ASE
  Bill Chen is Fellow and Senior Technical Advisor at ASE Group. He is Past President of IEEE CPMT Society.He is Fellow of IEEE and of ASME.
Speaker: Mark Poliks, Professor SSIE, Binghamton University
  Mark D. Poliks is a Professor of Systems Science and Industrial Engineering and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. His research is in the areas of high performance electronics packaging, flexible electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He has authored numerous technical papers and invited presentations. He holds over forty US patents.
Speaker: Jim Wilcox, CPMT - Binghamton
  Jim Wilcox has 30+ years of electronic packaging experience with IBM covering a wide range of endeavors from flip-chip packaging to enterprise server assembly, from process development to manufacturing support to contract manufacturing supply chain engineering. Trained as a metallurgical engineer, he also holds the PhD degree in Materials Science from Cornell University. He has contributed numerous publications in areas of packaging interconnect and assembly and holds 35 patents on various aspects of electronic packaging. Throughout his career, Dr. Wilcox has been active in industry collaborative efforts, serving on Technical Advisory Boards for the IEEC, the Semiconductor Research Corporation and the High Density Packaging User Group.
Speaker: James P. Libous, IEEE Fellow, Lockheed Martin Corporate Engineering & Technology
  James P. Libous is a corporate technology and innovation leader focused on transformational technology, business innovation, and growth. He has over 32 years of leadership experience at IBM and Lockheed Martin directing R&D and commercialization of advanced technology, products, and services for the Semiconductor, High Performance Computing, Telecom, A&D, and Global Security industries. He is currently responsible for emerging electronics technology R&D and innovation strategy at Lockheed Martin Corporate Engineering & Technology. In this capacity, he develops corporate technology and innovation initiatives for the 60,000 engineers and scientists in Lockheed Martin.
Libous serves on multiple advisory boards and received numerous awards for contributions to industry and academia, including the Union College Outstanding Electrical Engineering Alumnus Award and the SRC Outstanding Research Leadership Award. He serves as a consultant on strategic business and government policies and investments to preserve the U.S. Industrial Base.
Libous holds multiple U.S. Patents, published numerous technical papers in refereed journals and international conference proceedings, and is a frequent speaker at conferences, colleges, and corporations. He holds a BSEE degree from Union College (NY) and MSEE degree from Syracuse University.
Binghamton University State University of New York
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Last Updated: 8/21/14