Binghamton University hosts flexible electronics symposium
BINGHAMTON, NY – Binghamton University’s Center for Advanced Microelectronics Manufacturing (CAMM) will host the third annual Flexible Electronics Symposium, scheduled for August 17-18 in the Mandela Room of the University Union.
The symposium, which has become the region’s premier forum for discussion of recent advances in the fields of flexible electronics, device and conductor printing, and emerging electronic materials, brings together leading researchers from academia, national labs, and industry from across the US. Attendees will hear from experts as they review and share new research findings in critical technology areas and identify issues for the rapidly growing flexible electronics field.
Symposium guests and presenters will also hear from John Pellegrino, director of the Sensors and Electron Devices Directorate (SEDD) in the US Army Research Laboratory, who will give the symposium’s keynote address. Pellegrino holds a bachelor's degree in physics from Gordon College, Boston, MA, and masters and doctoral degrees in physics from the University of Wisconsin, Madison, WI. Prior to his appointment as director, Pellegrino served as Chief of the Electro-Optics and Acoustics Division and Associate Director for Sensors Research at the SEDD. He also served as Chief of the ARL Signal and Information Processing Division, and Chief of the Optical Processing Branch at Harry Diamond Laboratories. Pellegrino serves as a member of the SPIE Board of Directors, Chair of the SPIE Symposia Committee, Chair of the Office of Secretary of Defense Energy and Power Technologies Initiative, Army member of the Defense Department Advisory Group on Electron Devices.
He is recipient of the 2009 Meritorious Presidential Rank Award; twice recipient of the U.S. Army Research and Development Achievement Award (1994 and1997), and a recipient of the Harry Diamond Laboratories Hinman Award for Technical Achievement (1986). He has authored and co-authored a broad range of technical papers and reports, and is co-editor of the book, Acousto-Optic Signal Processing.
The two-day symposium is expected to draw over 175 speakers and guests to the Greater Binghamton community. In addition to the discussion of research and development areas, and a student poster session, attendees will also get a first-hand look at a key facility in the region’s growing flexible electronics hub when they visit Binghamton University’s CAMM’s roll-to-roll manufacturing research center, located at partner, Endicott Interconnect Technologies, in Endicott, NY.
A highlight of the tour will include a viewing of CAMM’s latest addition, the CHA Industries Web Coater. The web coater was added to CAMM’S impressive array of R2R microelectronics manufacturing equipment earlier this year and is the culmination of a long-standing relationship between CHA Industries and the Flex Tech Alliance, a public/private partnership chartered with developing the flexible electronics and displays industry supply chain. It was built under contract to the Flex Tech Alliance, which is working with its member companies and CAMM to commercialize flexible, printed electronics for multiple dual-use (commercial and defense) markets. These include communications, lighting, photovoltaics, and sensors.