Binghamton University to host advanced technology symposium

2011-09-19

BINGHAMTON, NY – Binghamton University’s Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology in electronics packaging, in conjunction with GEI Global Research, GE’s central technology development arm, and the IEEE Component, Packaging and Manufacturing Society, will host the annual Electronics Packaging Symposium on October 10 and 11, at the Holiday Inn Arena, located on Hawley Street in Binghamton, NY

The symposium will bring together leading researchers from academia, national labs and industry to focus on electronics packaging, a field that encompasses all components of computers, cell phones and other electronic devices, except for the integrated circuit or chip.

Topics of discussion will include packaging trends, thermal management, 3-D packaging, sensors, electronics packaging for harsh environments, miniaturization, and flexible/printed electronics.

The symposium will include a student poster session, a technology showcase spotlighting local industry, a networking reception and a dinner speaker.

For information on cost of attendance and registration details, visit
http://www2.binghamton.edu/s3ip/education/symposium2011/index.html 

For additional information, contact Bill Infantolino, associate director of the IEEC, at binfanto@binghamton.edu or 607-777-4349.

Last Updated: 9/17/13