Binghamton University opens cutting-edge microelectronics manufacturing center

2008-03-31

 BINGHAMTON, N.Y. -- Binghamton University inaugurated its Center for Advanced Microelectronics Manufacturing (CAMM) facility today in a ceremony attended by business, political and community leaders. A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format. These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays, and product identification and tracking.

The CAMM is an integral component of Binghamton University’s New York State Center of Excellence in Small Scale Systems Integration and Packaging. As one of New York State's most innovative initiatives, the Centers of Excellence (COE) support high technology ventures through a collaborative approach among the State, academia, private venture capital companies, and other private and public sector parties. As one of only six COE’s in New York, Binghamton University’s Center specializes in small-scale systems design, process development, prototyping, and manufacturing for academia and the microelectronics industry.

Plans for the CAMM were initiated in 2005 when the United States Display Consortium (USDC) selected Binghamton University to manage this new initiative.  The USDC provided $12 million in equipment to establish the CAMM, which is hosted by Endicott Interconnect Technologies and draws collaborative resources from Cornell University.

From the USDC’s initial collaboration, the CAMM has grown into a facility that consists of a 10,000 square foot area and clean room. It includes an integrated roll-to-roll flexible electronics prototype manufacturing line, and an associated microfabrication laboratory. CAMM facilities also include a precision lithography stepper, vacuum coaters, and an in-line defect inspection capability.

“Binghamton University is a world leader in small scale systems integration and packaging research,” said Binghamton University President Lois B. DeFleur. “The Center for Advanced Microelectronics Manufacturing offers an unparalleled research and development capability that will help businesses compete in the global marketplace and spur economic advancement in the Southern Tier, New York State and the nation.”

 

Currently, most advanced electronics components are produced on silicon or quartz wafers, or on plates of specialized glass in a “batch” process that has been the backbone of the integrated circuit (IC) and flat panel display (FPD) industries. A R2R process, which integrates electronics on flexible plastic means, in theory, that components can be produced more efficiently, at higher yields and at a lower cost than is common practice today and opens up potential new application areas for flexible electronics.       

Directed by Bahgat Sammakia, professor of mechanical engineering and director of Binghamton University’s New York State Center of Excellence in Small Scale Systems Packaging Center, the CAMM will evaluate equipment and materials developed under the auspices of USDC, industry and its own research and development program that will be further developed into a fully-integrated prototype manufacturing line. The CAMM will also provide large-scale testing whereby academic and industrial research groups can test their work for manufacturing applicability without the high costs and risks typically associated with such activities. 

Equipment is accessible to both the University community and private industry, which participates in the CAMM through paid membership fees and funded research programs. CAMM’s corporate members include Endicott Interconnect Technologies, General Electric, Kodak, Corning Incorporated, Texas Instruments and Samsung Electronics Company. Additional partners and supporters include the National Aeronautics and Space Administration, the Army Research Laboratory, and New York State Foundation for Science, Technology and Innovation.

The CAMM is also working in tandem with the U.S. Army-funded Flexible Display Center (FDC) at Arizona State University (Tempe, Ariz.) on display-related R&D. The FDC focuses on process development and pilot production of flexible backplanes and displays for U.S. Army platforms and eventually, commercial applications.

Note to editors:  Please see attached quote sheet.  Photos available upon request.

 CAMM Opening Quote Sheet 

 

Jay McNamara, President and CEO, Endicott Interconnect Technologies:

“Endicott Interconnect is very proud to serve as host to the Center for Advanced Microelectronics Manufacturing.  Our unique working partnerships with both Binghamton University and Cornell University have resulted in a truly impressive facility that offers EI the opportunity to develop new technology and manufacturing capability for low-cost, high function electronic systems on flexible substrates.  This technology will be the backbone of tomorrow’s electronics, fueling job growth in the U.S. and in our industry.” 

Mike Ciesinski, President, USDC:

“Our award to Binghamton University three years ago was based on a vision, which was enabling a university with an entrepreneurial spirit to collaborate with private industry in order to establish a center for next-generation electronics R&D and prototype manufacturing. On behalf of USDC, I would like to congratulate Binghamton University, and its partners Cornell University and Endicott Interconnect Technologies, for achieving the aggressive milestones we set surrounding the establishment of the Center for Advanced Microelectronics Manufacturing.  Binghamton University been extremely successful in building a state-of-the-art facility and recruiting industrial partners, while at the same time securing federal and state funding and integrating the tool sets provided by USDC's development partners.  The Southern Tier and the state of New York can now capitalize on this unique asset and compete in the exciting flexible and printed electronics industry.” 

Senator Hillary Rodham Clinton (D-NY):

“Congratulations to Binghamton University on the opening of the Center for Advanced Microelectronics Manufacturing. As a member of the Senate Armed Services Committee, I have tracked the need for the latest generation electronics technologies for our Armed Services and I am proud to support local efforts to provide our military with the best technology available. CAMM also represents a great opportunity to continue to sharpen upstate New York’s competitive posture in the 21st Century. I am also a strong supporter of CAMM’s efforts to attract state, national and international companies to further advance electronics manufacturing in upstate New York.” 

Congressman Maurice Hinchey (D-NY 22nd):

“This new equipment and expertise is enabling Binghamton University to position itself at the forefront of technological innovation. With its focus on the emerging area of flexible electronics, the Center for Advanced Microelectronics Manufacturing will open the door for cutting edge research with applications for use in our nation's defense and solar energy sectors along with a wide variety of other fields.  I am a founding supporter of this exciting initiative because I know that microelectronics science and engineering are national priorities and investments are needed to enhance our national security and strengthen our place in the global economy. The CAMM is the right initiative at the right time and I am confident that it will provide practical, measurable benefits to our local economy while advancing critical national priorities.I look forward to continuing to advance and grow the center as we also look to further establish New York as a national and international leader in solar energy research and development.” 

New York State Senator Thomas W. Libous, R-Binghamton:

“As our society continues to gear toward more high-tech careers and information, Binghamton University continues to stand at the front of the line.  Together, we’ve been very successful at creating career opportunities in the Southern Tier.  Our new CAMM Center in Endicott will do a lot to continue creating careers to keep our youth here much like other local high-tech leaders like Lockheed Martin and BAE Systems.” 

New York State Assemblywoman Donna Lupardo, D-Binghamton:

“As part of the Binghamton University’s Center of Excellence, the CAMM will help maintain the Southern Tier's leading edge in microelectronics research that benefits companies across our region. I applaud Binghamton University, its faculty, staff and students for their leadership in this area.” Edward Reinfurt, Executive Director of NYSTAR“The Centers for Advanced Technology (CAT) continue to be a critically important component of the State's high technology development efforts.  NYSTAR is pleased to continue its long-term commitment to the Binghamton CAT's outstanding developments in electronics and, in particular, new flexible electronics that will result in new applications from faster and smaller electronic devices to solar panels.  Through partnerships with the new Center for Advanced Microelectronics Manufacturing, we will help emerging and existing New York companies be world-class manufacturers in the global economy by harnessing the power of innovation.” 

Edward Reinfurt, Executive Director of NYSTAR:

“The Centers for Advanced Technology (CAT) continue to be a critically important component of the State's high technology development efforts.  NYSTAR is pleased to continue its long-term commitment to the Binghamton CAT's outstanding developments in electronics and, in particular, new flexible electronics that will result in new applications from faster and smaller electronic devices to solar panels.  Through partnerships with the new Center for Advanced Microelectronics Manufacturing, we will help emerging and existing New York companies be world-class manufacturers in the global economy by harnessing the power of innovation.”

Daniel C. Gundersen, Upstate Empire State Development Chairman:

“This innovative center will enable new manufacturing applications to prosper in the Southern Tier and keep Upstate New York on the cutting edge of emerging technology. The intellectual capital at Binghamton University is being paired with government and industry to fuel Upstate New York’s innovation economy, and it’s collaborations like this one that have great potential to spur economic growth statewide.” 

Gerald Sonnenfeld, Vice President for Research, Binghamton University:

“Binghamton University is committed to fostering the development of unique projects that have the potential to change lives. The CAMM, which is part of our New York State Center of Excellence in Small Scale Systems Integration and Packaging, is a prime example of the innovative multidisciplinary, multi-institutional microelectronics at Binghamton University. The CAMM provides excellent educational opportunities for our students and is paving the way for new and exciting research that will spur economic growth in the Southern Tier.” 

Bahgat Sammakia, Director, Center for Advanced Microelectronics Manufacturing, Binghamton University:

“The Center for Advanced Microelectronics Manufacturing holds the potential to greatly improve many existing electronic systems applications and to enable new unimagined applications. The CAMM is a true partnership between government, academia and industry, which will provide Binghamton University the opportunity to perform unparalleled research in the area of flexible electronics and small-scale systems integration and packaging. Binghamton University’s partnerships with the United States Display Consortium, Endicott Interconnect Technologies and other industrial partners, Cornell University and other academic partners, the Army Research Laboratory, the National Aeronautics and Space Administration, and New York State, are key to the success of this Center.” 

Chris Ober, Francis Bard Professor of Materials Engineering, Cornell University:

“The Cornell College of Engineering is thrilled to be partnering with our colleagues at Binghamton University on research at the Center for Advanced Microelectronics Manufacturing. Together, we will develop enabling technologies and new educational approaches that will transform the semiconductor industry in the new paradigm defined by flexible electronics.” 

Charles Becker, Chief Scientist, Micro and Nano Structures, General Electric Corporate Research and Development:

 “On behalf of the member companies, I am pleased to participate in the opening of the Center for Advanced Microelectronics Manufacturing. The shared resources being developed at the CAMM are critical to the key technology roadmaps of each participating member company. By offering unique, state-of-the-art tools and process expertise for roll-to-roll manufacturing, CAMM will be a cornerstone of the new flexible electronics revolution. We, at GE, are particularly excited to be collaborating with other leading technology companies and with Binghamton University on fundamental enabling research in the area of flexible electronics.” 

Mark Hartney, Chief Technology Officer, United States Display Consortium:

“Binghamton University’s demonstrated strengths in science and engineering and prior center management experience, as well as its partnering and leadership attributes, were key criteria in establishing the Center for Advanced Microelectronics Manufacturing in Binghamton, New York. We are confident that the cooperative academic, government and industry relationships that Dr. Sammakia has amassed will greatly contribute to the success of this aggressive R&D program.“

Last Updated: 9/17/13