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Binghamton University wins R&D contract from The U.S. Display Consortium for Roll-To-Roll Manufacturing

2005-01-24

Binghamton University and the U.S. Display Consortium (USDC) today announced that the University has been awarded a competitively bid contract from the USDC to establish and operate the Center for Advanced Microelectronics Manufacturing (CAMM).  The USDC will initially provide $10 million in equipment to establish the center, which will combine resources from the USDC, Binghamton University and other academic, government and industry partners to help speed microelectronics manufacturing research and development in a roll-to-roll (R2R) format.

Currently, most advanced electronics components are produced on silicon or quartz wafers, or on plates of specialized glass in a “batch” process that has been the backbone of the integrated circuit (IC) and flat panel display (FPD) industries.  A R2R process means, in theory, that components can be produced more efficiently, at higher yields and at a lower cost than is common practice today because material handling is reduced and throughput rate is increased with a continuous web process.  The expected R2R result is conformable, rugged, lightweight electronic components and innovative products for commercial, consumer and military markets.

To initiate a R2R prototype manufacturing line for the production of electronic components and products at the CAMM, the USDC will provide a Model 6600 lithography system from Azores Corp (Wilmington, Mass.) and a Model Mark 80 vacuum thin-film deposition system from CHA (Fremont, Calif.), which will include two deposition sources being developed by the Kurt J. Lesker Co. (Clairton, Pa). The USDC program is a collaborative effort of private industry and the U.S. Army Research Laboratory in Adelphi, Maryland.

According to the USDC’s Chief Technology Officer Dr. M. Robert Pinnel, Binghamton was awarded this USDC contract for a number of reasons.  “Binghamton University’s demonstrated strengths in science and engineering and prior center management experience, as well as its partnering and leadership attributes, were key criteria in our selection process,” said Pinnel.  “Also, identification and commitment of New York State and regional economic resources were crucial.  We are confident that this University’s resources and its cooperative and progressive academic, government and industry relationships will greatly contribute to the success of this aggressive R&D program.”

Directed by Dr. Bahgat Sammakia, professor of mechanical engineering and director of Binghamton University’s Integrated Electronics Engineering Center and its Small Scale Systems Packaging Center, the CAMM will evaluate equipment and materials developed under the auspices of USDC, industry or its own R&D program that can be further developed in a fully-integrated manufacturing line. Equipment will be accessible to both the University community and private industry, which will participate in the CAMM through paid membership fees and funded research programs. The CAMM will also provide large-scale testing whereby academic research groups can test their work for manufacturing applicability without the high costs and risks typically associated with such activities.

“This award acknowledges Binghamton University's stature as a leader in small scale systems integration and packaging research,” said Binghamton University President Lois B. DeFleur. “Through the Center for Advanced Microelectronics Manufacturing, we will create a unique and unparalleled research and development capability that will strengthen partnerships between the University and the private sector. This will contribute to economic advancement in the Southern Tier, New York State and the nation. This Center is another example of the growing impact of Binghamton University's academic and scientific expertise.”

Under the terms of the contract, Binghamton University will establish the CAMM at Endicott Interconnect Technologies in Endicott, N.Y.  The University will recruit, integrate and manage academic, government and industry participation with which it will share innovations, and it will create, launch and maintain the technical R&D program. Cornell University and Endicott Interconnect Technologies will assist in establishing the center.

The CAMM will also work in tandem with the U.S. Army-funded Flexible Display Center (FDC) at Arizona State University (Tempe, Ariz.) on display-related R&D.  The FDC is already focusing on process development and pilot production of flexible backplanes and displays for U.S. Army platforms and, eventually, commercial applications.

The CAMM will focus on development of new, higher efficiency manufacturing platforms and address a wide range of manufacturing process and materials developments necessary to meet the needs of a broad array of electronic devices in flexible end products.

“I extend congratulations to Binghamton University for winning this contract from USDC,” stated Senator Hillary Clinton (D-NY).  “As a member of the Senate Armed Services Committee, I have tracked the need for the latest generation communications and power technologies for the Armed Services.  I am confident that the R&D Center at Binghamton University will not only be an invaluable asset to our nation s technology base and a big boost to upstate New York’s competitive posture in the 21st Century, but will also attract state, national and international companies to further advance electronics manufacturing,” added Sen. Clinton.

Last Updated: 9/17/13