Binghamton University to host electronics packaging symposium
The Thomas J. Watson School of Engineering and Applied Science at Binghamton University will host an international electronics packaging symposium, October 21 - 23, in the Mandela room of the University Union on the campus.
The symposium will bring many of the nation’s leading experts to Binghamton University to share recent developments, new technologies, manufacturing methods, and discuss business and technology trends of the electronics industry. Discussion will center on the use of photon technology to meet the demand for increased information at faster speeds. The conference will also discuss issues related to the application of photonic and optical technologies, known as optoelectronics, to electronics hardware.
Engineers and technical managers from across the United States and Canada will join local engineers to learn more about photonic technologies and applications. The evolution from electronics to optoelectronics is especially important to the greater Binghamton region where about 70% of all manufacturing activity involves electronics at some level. The implementation of optoelectronics technologies is seen as the next advancement for the packaging industry. As optoelectronics evolves, many new components and products will need to be designed and manufactured ushering in the next wave of technology innovation in the packaging industry.
The symposium begins at 8 a.m. Monday, October 21, with a keynote address by Binghamton University alumnus Gary Kunis, vice president and chief science officer for Cisco Systems. His address is titled “Where is the Optoelectronics Industry Headed?” Kunis joined a small start-up Silicon Valley company in 1990 where he served as a founding partner. It is now known as Cisco Systems, a multinational corporation recognized as the leader in networking equipment. Kunis is currently Vice President and Chief Science Officer.
He is also the executive sponsor for Cisco's Japan operations. Prior to his founding work at Cisco, Kunis worked at the Boeing Corporation as the chief networking engineer where he worked on numerous Internet projects for the U.S. government, the Department of Defense, and NASA. He also led a National Science Foundation (NSF) project to develop and deploy NorthWest Net, which became the Internet backbone for the Pacific Northwest region and the largest undertaking in the nation at the time. Kunis completed his undergraduate degree in history at Binghamton University in 1973 and also holds a master’s degree in economics from Tufts University in 1976. He returned to the Watson School of Engineering and Applied Science in 1984 to pursue another graduate degree in computing. Kunis was recently awarded an honorary doctorate degree in humane letters at Binghamton University's 2002 commencement exercises.
A highlight of the Monday, October 21, schedule includes a poster and exhibit session beginning at 4:45 p.m. The session will feature posters produced by doctoral students, which focus on the research and development at the University, and highlight the collaborative linkages that the University has with local companies. The session will also include industry displays as well as exhibits relating to the University’s IEEC and Strategic Partnership for Industrial Resurgence (SPIR) outreach programs.
Breakout sessions during the three-day symposium will include discussion on standard development, process developments and manufacturing processes, interconnection and automation technologies, and materials development.
The symposium is open to the public. Registration fees for the full symposium, which include course materials, morning and afternoon refreshments, lunches, course materials and parking, is $765. One-day symposium attendance is $200.
The symposium is sponsored by the Watson School’s Office of Engineering Development and the Integrated Electronics Engineering Center (IEEC) at Binghamton University.
For further information on the symposium and related events, call the Office of Engineering Professional Development at 607-777-2154, toll free: 1-888-691-1465. Information is also available on the symposium website at http://www.wtsn.binghamton.edu/coned/EP%2002%20Main.htm.