INSIDE BINGHAMTON UNIVERSITY
CAMM facility opens
Binghamton University inaugurated its Center for Advanced Microelectronics Manufacturing (CAMM) facility Monday in a ceremony attended by business, political and community leaders.
A collaborative effort by Binghamton University, Endicott Interconnect Technologies and Cornell University, the CAMM will pioneer microelectronics manufacturing research and development in a roll-to-roll (R2R) format.
These efforts will result in flexible, rugged, lightweight electronic components and innovative products that will be critical to next-generation applications in areas such as military and homeland security, lighting, energy and power generation, displays and product identification and tracking.
The CAMM is an integral component of the University’s New York State Center of Excellence in Small Scale Systems Integration and Packaging. The Centers of Excellence support high-technology ventures through a collaborative approach among the state, academia, private venture capital companies and other private and public sector parties. Binghamton’s center specializes in small-scale systems design, process development, prototyping and manufacturing.
Plans for the CAMM were initiated in 20
Rep. Maurice Hinchey, left, President Lois B. DeFleur, center, Bahgat Sammakia, far right, and others examine a roll-to-roll metallizing machine at the CCAMM facility on Monday at Endicott Interconnects Huron Campus.
“The CAMM builds on historic strengths in technology, both at the University and in the community,” President Lois B. DeFleur said. “This is how our area, our state and our nation can remain competitive — by leveraging our intellectual capacity.”
Rep. Maurice Hinchey predicted the center’s immense potential could usher in a “new industrial revolution” and pay big dividends in terms of research, education and economic development.
The CAMM has grown into a 10,000-square-foot facility. It includes an integrated roll-to-roll flexible electronics prototype manufacturing line and an associated microfabrication laboratory. CAMM facilities also include a precision lithography stepper, vacuum coaters and an in-line defect inspection capability.
DeFleur, Hinchey and other leaders toured the facility Monday, donning lab coats and shoe covers for a visit to the “clean room”
Hao Zhang, a doctoral student in mechanical engineering, examines a piece of roll-to-roll electronic material.
Currently, most advanced electronics components are produced on silicon or quartz wafers, or on plates of specialized glass in a “batch” process that has been the backbone of the integrated circuit and flat panel display industries. A R2R process, which integrates electronics on flexible plastic means, in theory, that components can be produced more efficiently, at higher yields and at a lower cost than is common today.
Directed by Bahgat Sammakia, professor of mechanical engineering and director of the Small Scale Systems Integration and Packaging Center, the CAMM will evaluate equipment and materials developed under the auspices of USDC, industry and its own research and development program. The CAMM will also enable academic and industrial research groups to test their work for manufacturing applicability without the typical high costs and risks.
Equipment is accessible to the University community and private industry, which participates in the CAMM through paid membership fees and funded research programs.