The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP) performs high-impact basic and applied research to support the technical translation of economically significant innovations such as electronics systems integration, flexible electronics, thin film solar power, energy management for electronic systems, new materials and sensors, and modeling, analysis and characterization, to national industry sectors. S3IP, a leading academic-industry-government partnership, is a critical participant in advancing these technologies and in training, with industrial partners, the essential educated work force. S3IP brings together an interdisciplinary, inter-institutional team of scientists, engineers and technologists, along with unparalleled infrastructure to achieve the following goals:
- develop novel research outcomes in emerging, people-friendly electronics;
- ensure economic development by providing a platform to assist with creation of new emerging technology companies;
- enhance US science and engineering education at all levels.