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Flexible Electronics

Research in flexible electronics is centered at S3IP’s roll to roll manufacturing facility, the Center for Advanced Microelectronics Manufacturing (CAMM). The CAMM’s objectives are to: undertake R&D that roadmaps flexible electronic technology; validates the design of flexible electronic manufacturing capabilities; develop essential process technologies and manufacturing know-how; demonstrate specific technologies and products through test bed projects and low volume device manufacturing; support new materials and advanced substrate technology development; and build prototype tool sets to enable new manufacturing operations.

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 4/1/10