Systems Integration and Packaging
Research in systems integration and packaging is centered at The Integrated Electronics Engineering Center (IEEC), a NYS Center of Advanced Technology. The IEEC performs leading edge research in electronics packaging and transfers those results to the New York State and U.S. packaging industries. Current Research areas of expertise include: electrical analysis; mechanical analysis and testing; solder analysis; thermal science; underfill science; micromechanics; photomechanics and failure mechanisms. IEEC researchers also conduct research on sensors and new materials for electronic systems and collaborate with the Center for Advanced Sensors and Environmental Systems (CASE), focused on sensors, sensor systems and environmental technologies; and the Institute for Materials Research (IMR); focused on research on new materials and their characterization.