Phone: (607) 777-4908
Fax: (607) 777-4094
- PhD, Texas Tech University, 1999
- statistical process control
- Informatio integrated manufacturing
- SSIE 562: Reliability Engineering (BU)
- SSIE 505: Applied Probability and Statistics (BU)
- SSIE 525: System Engineering (BU)
- SSIE 566: Design of Experiment (BU)
- SSIE 561: Quality Assurance for Engineers
- ISE 362: Probability Systems II
Current Research Projects:
- Using Nanostructured Sensing Array Materials, NNSA, 09/2004 - 08/2007, $400,000
- Transuranic aqueous metal ion sensor systems with wireless communication for discrete monitoring of nuclear materials, NNSA, 09/2004 - 02/2007, $450,000
Published/Accepted Journal Papers
Multivariate Performance Reliability Prediction in Real-Time, Journal of Reliability Engineering and System Safety, Vol. 72/1, pp. 39- 45, 2001.
Real-Time Performance Reliability Prediction, IEEE trans. on Reliability, Vol. 50/4, pp353-357, 2002.
A Real-Time Approach to Human Performance Assessment with Fuzzy Logic, fully accepted and to be published, IIE transactions, 2003.
Ashish Batra, Pradeep Ramachandran, Poornima Sathyanarayanan,Susan Lu and K. Srihari, "Reliability Enhancement of Electronic Packages by Design of Optimal Parameters, " Microelectronics Reliability, Vol. 44/7, pp 1157-1163, 2004
Susan Lu, Sarah Lam, Wei-Yun Cheng, "Yield Enhancement and Yield Modeling for Mass Reflow Process of 0201 Components," Vol. 17/4, 2004.
Li Han, Xiajing Shi , Wendy Wu, F. Louis Kirk, Jin Luo, Lingyan Wang, Derrick Mott, Susan Lu and Chuan-Jian Zhong, "Nanoparticle-Structured Sensing Array Materials and Pattern Recognition for VOC Detection, Journal of Sensors and Actuators." B., 2005, 106, 431-441.
Ta-Hsuan Lin, Donald G. McBride, Frank Andros, and Susan Lu, A Study on Molding Material For Flexible Flip Chip Connection, Journal of Surface Mount Technology, In press.
Publications in Fully Refereed Conferences
Automatic Pattern-Plate Layout in Vertical Parting Cast, Third International Conference of Computer Application in Mechanical Engineering, China, 1992.
A Real-Time Reliability Monitoring Prototype, IERC'98, CD, 1998.
Human Reliability Performance Metrics and Modeling Strategies, IERC '99, CD, 1999.
Real-Time Conditional Reliability Assessment with On-Line Data Acquisition, The Fourth International Conference on Electronic Measurement and Instruments, CD, Harbin, China, 1999.
Intelligent Failure Prediction and Fault Diagnosis Systems, Proceedings of 4th International Conference on Frontiers of Design and Manufacturing, pp. 657-663, Hangzhou, China, 2000.
Yield Modeling for Mass Reflow Process of 0201 Components Using Neural Networks, ANNIE' 2002 Proceedings, 2002.
An Intelligent Integration Of SPC and EPC In Industrial Manufacturing Processes, Proceedings of 5th International Conference on Frontiers of Design and Manufacturing, pp. 657-663, Dalian, China, 2002.
Temporal and Spatial Variation Modeling For Six Sigma Manufacturing, IERC 2003, CD, 2003.
On-Line Ham Auto-Grading By Knowledge-Based Color Image Recognition, IERC 2003, CD, 2003.
Demand forecasting using Fuzzy Time Series, IERC 2004, CD, 2004.
Process Optimization of Plated-through-hole (PTH) Process using Evolutionary Operation (EVOP), IERC 2005, CD, 2005.
Fermentation Process Modeling Data Preprocessing Strategies Using Neural Networks, IERC 2005, CD, 2005.
Predictive Conditional Based Maintenance Strategy Based on Real-time Performance Reliability Monitoring, International Conference on Quality and Reliability, 2005.
Publications in Conferences with a Proceedings/Presentations
Research on Surface Chemical Coloring and Protection Technology for Aluminum Alloy Fasteners, Proceeding s of the second China/Japan international Symposium on Fasteners, Beijing, China, 1994.
New Concepts in Human Reliability Models, IEEE SMC conference, San Diego, 1998.
Real-Time Human Performance Reliability Assessment, the Human Factors and Ergonomics Society/ International Ergonomics Association, 2000 Meeting, San Diego, CA, 2000.
Publications in Conferences with a Presentation
Reliability Modeling in Real-Time, Amarillo National Resource Center Researchers' Conference, Amarillo, 1998.
Journal Paper in Review:
Assembly of Copper Column Interconnect Flip Chip, Submitted to IEEE Transactions on Electronics Packaging Manufacturing, reviewed and in revision.