Mark D. Poliks, Ph.D.
Professor, System Science and Industrial Engineering
Technical Director, S3IP-Center for Advanced Microelectronics Manufacturing (CAMM)
Mark D. Poliks is a Professor of Systems Science and Industrial Engineering and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. He is an expert in electronics packaging, flexible electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He has authored numerous technical papers and invited presentations. He holds over forty US patents.
He is a member of the Flex-Tech Alliance technical council, an Associate Editor of the "Journal of Electronic Packaging," a member of the American Chemical Society, the Materials Research Society and the IEEE/CPMT. Poliks is active in the leadership of the IEEE/CPMT Electronic Components and Technology Conference (ECTC) serving as chair of several technical program sub-committees. He chaired the 2010 ECTC plenary session on "The Evolution of Mobile Processing Architectures" and was a symposium organizer of "Roll-to-Roll Processing of Electronics and Advanced Functionalities" at the 2012 fall meeting of the Materials Research Society. He was invited to teach short courses on "Roll-to-Roll Manufacturing" at three international meetings of the Flex-Tech Alliance. Poliks received the Flex-Tech Alliance "FLEXI Award" for leadership in the technology and education of flexible electronics and the S3IP / STOC "Technology Leader of the Year" award.
He has held senior technical management positions at Endicott Interconnect Technologies, Inc. and IBM Microelectronics. He was a founding member of the IBM Materials Research Community and received an IBM award for "Excellence in Technical Management." Poliks received his Ph.D. in materials science and engineering from the University of Connecticut and held a McDonnell-Douglas postdoctoral fellowship at Washington University in St. Louis.