on school wide expertise in electronics packaging, the Thomas
J. Watson School of Engineering and Applied Science is able to
offer an optional sub-specialization graduate credential in Electronics
Packaging. The Watson School's Electronics Packaging Education
Committee coordinates the sub-concentration certificate program
and the certificate is awarded in recognition of a student's electronics
packaging academic and practical expertise.
satisfy the requirements for the certificate program, in addition
to completing degree
requirements, students must complete the following requirements:
- Academic : WTSN 582 (Electronics Packaging Theory
and Applications) and additional departmental course which focuses
on packaging issues)
- Research (thesis, project or dissertation must be packaging
- Enrichment (symposia and WTSN 581 which is a one hour
seminar course covering diverse packaging topics)
Watson School offers graduate degree programs leading to Master
of Science (MS), Master of Engineering (MEng) and Doctor of Philosophy
(PhD) degrees. The areas of specialization are as follows:
Engineering (MS, MEng, PhD)
Engineering (MS, PhD)
Engineering (MS, PhD)
Science (MS, PhD)
Science (MS, PhD)
learn about degree plan requirements, please review the University
- The program is also available to graduate students in Binghamton
University's Chemistry and Physics programs.
successful completion of the requirements of the electronics packaging
concentration, students receive special certification indicating
successful completion of the requirements of the concentration
program. Students qualifying for the certificate may be enrolled
in either Masters of Science, Masters of Engineering or Doctoral
graduate programs. The certificate is only awarded to students
completing one of these degrees.
Electronics Engineering Center
largest research center at the Watson School of Engineering and
Applied Science, is one of the best places in the US for graduate
studies centered on electronics packaging.
students have an extraordinary opportunity to work with distinguished
faculty and industry researchers, both in state-of-the -art campus
labs in in industrial settings.
faculty researchers work closely with graduate student researchers
on projects of critical importance to some of the nation's most
prominent high technology firms.
School faculty from the departments of industrial, mechanical
and electrical engineering and computer science, as well as from
the University departments of chemistry and physics have pooled
their expertise to develop a comprehensive research program.
students must apply to the Graduate School for admissions to the
University. More details
about the degree programs and the application process are
being admitted to a Watson School graduate program, students should
complete a Certification Completion Check form (available
in the Watson School Dean's
director of the IEEC will work with students to customize activities
(research, curricula and enrichment) to meet learning objectives.
electronics industry is based on the most rapidly changing high
technology in history. Miniaturization of semiconductor chips
advances each year. Millions of transistors can now be placed
on a silicon chip smaller than a postage stamp, and each year
concentration of transistors almost doubles. These advances hold
great promise. However, the limits of packaging technology
prevent industry from designing microchips to their full potential.
continuing challenge is to reduce power consumption, heat and
costs while increasing the speed, reliability and functionality
of each chip. Electronics packaging is the process of bringing
increasingly sophisticated chips, with their resident circuitry,
to forms that can be optimally packaged into a larger microelectronics
assembly, whether for computers, consumer electronics, aerospace
or the automotive industry.