|S. Maniam Ramkumar||December 2007||‘A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Assembly'|
|Mukesh. Selvaraj||December 2007||‘Electromigration and the Reliability of Flip Chip Assemblies’|
|Guhan Subbarayan||December 2007||‘Manufacturing and Reliability Evaluation of Mixed Alloy Solder Joints'|
|Santosh. A. Kudtarkar||May 2008||'Investigation of Ball Bond Integrity for 0.8 mil (20 Microns) Diameter Gold Bonding Wire on Low k Die in Wire Bonding'|
|Satya.Iyer||May 2008||‘Assembly, Reliability, and Rework of Stacked CSP Components'|
|Sreekanth Ramakrishnan||July 2008||'A Simulation-based Framework for Integrating Operational Models with Business Process Models in a Global Business Environment'|
|Joshua Bosier||October 2007||‘Designing an Integrated Surgical Care Delivery System'|
|Shashank Khandekar||November 2007||‘Heuristic Scheduling of Low Acuity Patients in the Emergency Department'|
|Siu-Lung Ng||December 2007||‘Reliability Assessment and Failure Analysis in Electronics Manufacturing’|
|G. Chennagiri||December 2007||‘Process Research and Reliability Assessment Over Multiple Rework Cycles For Flexible Substrates'|
|Jing Li||December 2007||‘Pad Cratering in the Reliability of Printed Circuit Boards'|
||‘Implementing An Efficient Quality Assessment System in an Automotive Environment'
|Ambarish More||December 2007||‘Knowledge Transfer and Process Implementation for Global Stencil Manufacturing Organization'|
||‘Process Research and Reliability Assessment for the Wave Soldering of ‘Thick’ Printed
|Davide Fusco||December 2007||‘An Evaluation Procedure for a New Surface Mount Connector'|
||'Simulation of a Complex Mix of Circuit Boards in a Drilling Environment'