Project Name: Improving Hole-Fill in Pb-Free Soldering of Thick PCB with OSP Finish
Graduate Student: Jing Li
The scope of this research is to evaluate and characterize one alternative Pb-free surface finish, Organic Solderability Preservatives (OSP), for achieving sufficient hole-fill in wave soldering. OSP coating can be affected by exposure to elevated temperatures, especially under more severe conditions of Pb-free process. Degradation of OSP coating could adversely affect wetting and spreading of alloy, which can result in poor hole-fill penetration during wave soldering. The objective of this research is to investigate the effect of change in certain properties of OSP coating in order to improve its performance and obtain adequate hole-fill with thick board (95 mils) during wave soldering.