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Larry Lehman
 

Larry Lehman

Laboratory Director
Email: lplehman@binghamton.edu
Phone: 607-777-6841
Office: CE A1115

Larry Lehman worked at Argonne National Laboratory Materials Science Division, for six years, with extensive experience as TEM microscopist studying mechanical deformation in metals. He received his PhD at the University of Notre Dame in 1986, then worked for IBM for 16 years. At IBM, he created a materials laboratory for the printer division in Endicott. Later he moved to the Thermal and Mechanical Analysis and Test group in the Microelectronics Division where he worked on many aspects of solder joining and packaging technology. During this period he became involved in the testing and evaluation of no-lead solder joints. Lehman holds five patents and 14 awards involving packaging and joining technologies. In 2001, Lehman joined the Research Foundation at Binghamton University. At Binghamton University, he continues to study no-lead solders, including the nucleation and growth of the Sn phase and the resulting microstructures and crystallography. He has published or participated in several papers on these subjects. Lehman is the founding manager for the Analytical and Diagnostics Laboratory (ADL) and currently serves as the laboratory director for the Small Scale Systems Integration and Packaging Center at Binghamton University.

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 5/2/18