Dr. William E. Bernier

Research Professor of Chemistry and Materials Science
and Engineering

• A.B., Chemistry, Brown University, Providence, RI
• Ph.D., Analytical Chemistry, State University of New York
  at Binghamton, Binghamton, NY
• MBA Certificate in Project Management, George Washington
  University, Washington, D.C.

Office:

Center of Excellence bldg - room 2224

Phone:

607-239-9626

Fax:

607-777-4478

Email:

wbernier@binghamton.edu
 

Research Interests:

• Materials and process development for Pb-Free semiconductor interconnection
• Electronic circuit packaging
• Nanotechnology
• Energy storage technology
• Materials and processes for device packaging for ultracapacitors and electrolytic capacitors

Recent Selected Publications

“Advanced Flip Chip Packaging”, ed. Ho-Ming Tong, Yi-Shao Lai, and C P Wong, Chapter 4 “Flip-Chip Interconnections – Past, Present & Future”, Sung-Kwon Kang, Da-Yuan Shih, and William E. Bernier, Springer, 2011