
Dr. William E. Bernier
Research Professor of Chemistry and Materials Science
and Engineering
- A.B., Chemistry, Brown University, Providence, RI
- Ph.D., Analytical Chemistry, State University of New York
at Binghamton, Binghamton, NY - MBA Certificate in Project Management, George Washington
University, Washington, D.C.
- Office:
- Center of Excellence bldg - room 2224
- Phone:
- 607-239-9626
- Fax:
- 607-777-4478
- Email:
- wbernier@binghamton.edu
Research Interests:
- Materials and process development for Pb-Free semiconductor interconnection
- Electronic circuit packaging
- Nanotechnology
- Energy storage technology
- Materials and processes for device packaging for ultracapacitors and electrolytic capacitors
Recent Selected Publications
“Advanced Flip Chip Packaging”, ed. Ho-Ming Tong, Yi-Shao Lai, and C P Wong, Chapter 4 “Flip-Chip Interconnections – Past, Present & Future”, Sung-Kwon Kang, Da-Yuan Shih, and William E. Bernier, Springer, 2011