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University Leads

Bahgat Sammakia

Bahgat Sammakia, a distinguished professor of mechanical engineering, is the Vice President for Research at Binghamton University and Center Director of the Center for Energy-Smart Electronic Systems. A former IBM senior technical staff member, Sammakia joined Binghamton's faculty in 1998. He is the founding director of the Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence. Sammakia earned his bachelor's degree from the University of Alexandria in Egypt and his master's and doctoral degrees from the University at Buffalo. He is a fellow of the American Society of Mechanical Engineers and a senior IEEE member. Sammakia, editor of the ASME Journal of Electronic Packaging, holds 14 U.S. patents and has published more than 180 peer-reviewed technical papers. Sammakia, who received the Chancellor's Award for Excellence in Scholarship and Creative Activities in 2010, was honored with the 2012 Thermi Award for his contributions to the field of semiconductor thermal management.

Contact Information
Bahgat Sammakia
(607) 777-6880

bahgat@binghamton.edu

 

 
Kanad Ghose

Kanad Ghose is professor and chair, Department of Computer Science at Binghamton University. He received his Ph.D. and M.S. degrees in Computer Science from Iowa State University in 1988 and 1986, respectively. He also holds the M.Tech. and B. Tech degrees in Electronics Engineering from the University of Calcutta, India. Ghose's research interests include Power-aware systems and microarchitectures, high-performance computing, VLSI design and experimental computer systems software. His research in the area of power-aware systems and microarchitectures has been funded by the National Science Foundation (NSF), DARPA, Intel Corporation and NYSERDA. Other sponsors of his research work include IBM Corporation, BAE Systems, Lockheed-Martin, the Air Force Office of Scientific Research and Sun Microsystems.

Prof. Ghose has 5 US patents and several pending patents, all but one as the primary inventor and two of his patents have been licensed. He has also been involved in transitioning his research work to the Industry. Two examples of this include a run-time communications and parallel programming library for a chip multiprocessor (for Lockheed-Martin) and a real-time Avionics file system (for BAE Corporation). Ghose has over 130 peer-reviewed technical publications in his research areas in journals and conferences and has successfully directed 16 Ph.D. dissertations to this date. Prof. Ghose heads the Computer Architecture and Power-Aware Systems research group at Binghamton, where he currently directs 8 Ph.D. students. He is a member of the editorial board an area editor for the IEEE Transactions on Computers. He is a 1986 inductee of the Phi-Kappa-Phi National Honor Society, a member of the IEEE and ACM.

Contact Information
Kanad Ghose
(607) 777-4803

ghose@cs.binghamton.edu

 

Amy Fleischer

Professor Amy Fleischer received her Ph.D. in Mechanical Engineering from the University of Minnesota in 2000. She is currently a Professor and Department Chair of Mechanical Engineering at Villanova University where she is also Director of the NSF I/UCRC Energy Smart Electronic Systems Research Center and Director of the NovaTherm Research Laboratory. Her research interests include the broad topics of sustainable energy system design and thermal management of electronic systems. Recent research projects have included energy storage in phase change materials, waste heat recovery from data centers, development of energy absorbing building materials, development of nano-enhanced materials including graphite nanofiber thermal interface materials, jet impingement, porous media heat sinks and boiling heat transfer. Dr. Fleischer is currently on the Executive Committee of ASME's Electronics and Photonics Packaging Division. Dr. Fleischer served as Chair of the ASME Heat Transfer Division K-16 Technical Committee on Electronics Thermal Management from 2009-2011. Dr. Fleischer was recognized as the ASME Electronics and Photonics Packaging Division (EPPD) 2010 Women Engineer of the Year and was awarded the 2011 ASME K-16/ EPPD Clock Award in recognition of her outstanding and continuing contributions to the science and engineering of heat transfer in electronics. She is an Associate Editor of the Journal of Heat Transfer and a past Associate Editor of the Journal of Electronic Packaging. She was awarded the Villanova University Outstanding Faculty Mentor Award in 2011. She is led the development of the McNulty Institute for Women's Leadership at Villanova University and is the founder of the "Engineering is for Girls! Day" at Villanova. Dr. Fleischer has supported 18 graduate students to degree completion and worked with 39 undergraduate researchers. She is the author of a recent monograph Phase Change materials: Fundamentals and Applications, published by SpringerBriefs, has edited one book, Thermes 2007: Thermal Challenges in Next Generation Systems and published more than 80 technical peer reviewed papers.

Contact Information
Amy Fleischer
(610) 519-4996

amy.fleischer@villanova.edu

 

 
Dereje Agonafer

Dr. Agonafer is Professor and Director of the Electronics, MEMS & Nanoelectronics Systems Packaging Center which he founded when he joined UTA in 1999 after working 15 years at IBM. He currently advises 25 graduate students - 10 PhD's and 15MSc students (http://emnspc.uta.edu). Since joining UT Arlington in 1999, he has graduated 73 graduate students. His research at the UT Arlington center is multidisciplinary and focuses on a variety of research related to thermo/mechanical issues in Microelectronics, MEMS and Nanoelectronics with broad applications including computers, telecommunications and bio-fluidics.

In addition to a PhD program focusing in packaging, Professor Agonafer established a certificate program in packaging in fall 2001. The Certificate in Electronic Packaging program provides graduate-level knowledge in the field of electronic packaging, with a concentration on numerical and experimental characterization of thermo/mechanical issues. Professor Agonafer has always been very active in professional society programs. He has been Guest Editor of special issues of The Journal of Electronic Packaging, The Journal of Heat Transfer, and IEEE's Transactions on Components, Packaging, and Manufacturing Technology. He has published over 150 papers and has 8 issued patents. Since 2002, he has been a member of the "ASME Technical Executive Committee." He was Editor in Chief, "Gordon and Breach Book Series in Electronic Packaging (1997-2000)," and has served as an Associate Technical Editor of the ASME Journal of Electronic Packaging. He is currently the Editor in Chief of ASME Press Book Series in Electronic Packaging and two books has since been published. From July 1997 - July 2000, he served as Chair of the ASME K-16 Committee in the Heat Transfer Division. He was Chair of the ASME Electrical and Photonic Packaging Division in 2000.

Professor Agonafer was the General Chair of InterPACK '99 and ITHERM'96. Professor Agonafer serves on the Scientific Advisory Board of a NSF Center, Mid-Infrared Technologies for Health and the Environment (MIRTHE) at Princeton University since 2007. He also serves on the Dean's Engineering Advisory Committee at both University of Colorado and Howard University. Professor Agonafer is a Fellow of The American Society of Mechanical Engineers International (ASME) and Fellow of The American Association for the Advancement of Science (AAAS). In April 1998, Professor Agonafer was the recipient of the The University of Colorado School of Engineering Distinguished Engineering Alumni Award (DEAA) in the category of Research and Invention. In November 1998, he received The Howard University Distinguished PhD Alumni Award. Also, in November 1998, he received ASME K-16/EEPD Clock Award for Outstanding Contribution in Computer Aided Thermal Management of Electronic Packages. In 2002, he received ASME International Electronic and Photonic Packaging Division Highest Division Award for Outstanding Contributions to the Area of the Application of the Science and Engineering of Heat Transfer to Electronic and Photonic Packaging. For the last 5 consecutive years, Professor Agonafer received an award from University of Texas at Arlington for having A strong record of external funding and scholarly achievement. Professor Agonafer received the Thermi Award at the 24th Annual Semi-Therm, March 2008, in San Jose, California. In July 2009, he delivered a keynote seminar in San Francisco as a recipient of the 2009 InterPACK Excellence Award. Professor Agonafer was at MIT as a Dr. Martin Luther King, Jr. visiting scholar September 1, 2007 – August 31, 2008.

Contact Information
Dereje Agonafer
(817) 272-7377

agonafer@uta.edu

 

 
Yogendra Joshi

Yogendra Joshi is Professor and John M. McKenney and Warren D. Shiver Distinguished Chair at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. His research interests are in multi-scale thermal management. He received a Bachelor of Technology degree in Mechanical Engineering from the Indian Institute of Technology in Kanpur in 1979, Master of Science in Mechanical Engineering from the State University of New York, Buffalo in 1981, and a Doctor of Philosophy in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania in 1984. He is the author or co-author of over 250 archival journal and conference publications, and is an elected Fellow of the ASME and the American Association for the Advancement of Science. He was a co-recipient of ASME Curriculum Innovation Award (1999), Inventor Recognition Award from the Semiconductor Research Corporation (2001), the ASME Electronic and Photonic Packaging Division Outstanding Contribution Award in Thermal Management (2006), ASME J. of Electronics Packaging Best Paper of the Year Award (2008), IBM Faculty Award (2008), and IEEE Semitherm Significant Contributor Award (2009).

Microelectronics and Emerging Technologies Thermal Laboratory (METTL) @ Georgia Tech.

www.me.gatech.edu/METTL

 

Last Updated: 1/24/18