Challenges & Opportunities of Flexible Hybrid Electronics for DoD Applications
In the past year, the Department of Defense (DoD) has highlighted technology priorities critical for enabling future capabilities through USD R&E’s Priority Technology Domains, the Army’s Modernization Priorities, and the Air Force S&T 2030 Strategy among others. This presentation will highlight how flexible hybrid electronics (FHE) could deliver many of the capabilities targeted by the DoD and impact applications such as wearables/medical, aircraft, satellites, and system sustainment. Technology development progress at NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, will be discussed by highlighting FHE modeling/design and fabrication/packaging successes as well as challenges for the future.
Bio: Benjamin Leever is currently the Technical Director in the Air Force Research Laboratory (AFRL) Manufacturing & Industrial Technology Division. As Tech Director, Dr. Leever is the principal advisor on internal & external technical programs for the division, and he functions as senior leader for the division addressing strategic planning & execution, definition of organizational & program policy, support for transition of technology, & establishment of appropriate partnerships with industrial customers. Until recently he also served as Government Chief Technology Officer of NextFlex, a $170M public-private partnership established to create a domestic manufacturing ecosystem in flexible hybrid electronics. Dr. Leever earned a B.S. in Chemical Engineering from the University of Cincinnati and a Ph.D. in Materials Science & Engineering from Northwestern University.