31st Annual Electronics Packaging Symposium

WELCOME TO OUR SYMPOSIUM HOMEPAGE!

 eps

GE Research and IEEC-Binghamton Univerisity invite you to join us for this two-day event on September 5 and 6, 2019 at GE Research Center in Niskayuna, NY.

This symposium brings together leaders in academia, industry and government to discuss electronics packaging topics of: 

  • 2.5/3D Packaging
  • mm Wave in Packaging
  • Automotive & Harsh Environments
  • Bioelectronics
  • Flexible & Additive Electronics
  • Materials for Packaging & Energy Storage
  • MEMS
  • Photonics
  • Power Electronics
  • Sensors, Embedded Electronics & IoT
  • Thermal Challenges
  • Wearable and Flexible Electronics for Medical Applications

We aim to share quality, up-to-date information through different lenses on trending electronics packaging topics, and provide opportunities to network, share ones expertise, learn, and build partnerships.

Last year our symposium successfully consisted of 380+ attendees, 52 invited speakers, 12 technical sessions, 54 student posters and 53 exhibits. We look forward to another year filled with knowledge-sharing opportunities.


                                 

KEYNOTE SPEAKERS:

Joseph Kolly

Joseph M. Kolly, PhD

Chief Safety Scientist

National Highway Traffic Safety Administration

 Talk: Technology and Safety Trends in

Automated Driving Systems

Brett Hamilton

Brett Hamilton (SSTM)

Distinguished Scientist for Trusted Microelectronics

Naval Surface Warfare Center, Crane Division

 Talk: Supply Chain Threats and the role of 

Heterogeneous Integration and Advanced

Packaging to Help Mitigate

khare

Mukesh Khare, PhD

Vice President, Semiconductor and AI Hardware

IBM Research

Talk: Technology Innovation for the AI Era

                                                                                

benjaminleever

Benjamin Leever, PhD

Technical Director, Industrial & Manufacturing

Technologies, Air Force Research Laboratory

 Talk: Challenges & Opportunities of Flexible Hybrid

Electronics for DoD Applications

    

    

EXECUTIVE CHAIRS:

Jim Lablanc

James W. LeBlanc
Technology Director, Electronics & Sensing                                                    GE Research
 

https://www.linkedin.com/in/jimleblanc/

Jim’s current role is Technology Director of Electronics & Sensing at the GE

Global Research Center. He leads a team of 130 scientists and engineers
covering a technology span that includes semiconductors, microelectronics and packaging, photonics, microsystems, and microfabrication tools and processes. He is responsible for managing all aspects of electronics and sensors technology development at Global Research and helping to drive strategic technology planning for the GE businesses.


Since joining Global Research in 1999, Jim has made key contributions including leading GRC’s computed tomography detector development program and subsequent transition of that technology to the GE Healthcare business unit. This technology was the critical enabler for the successful LightSpeed VCT product introduction. Jim was promoted to Manager, Detector Technology Lab in 2001. In 2005, he became Manager of the CT Systems Lab, which was later expanded in 2007 to include X-Ray Systems.


In 2008 Jim was named Manager of the Thin Films Laboratory where he played a critical role in transitioning digital X-ray technology and manufacturing to a new GE Healthcare production facility, and was a driving force behind the development of GRC’s cadmium telluride thin film solar team, including establishing multiple world record cell efficiencies. In 2013, Jim transitioned into a Business Portfolio Leader role, overseeing a ~$20M portfolio for GE’s Oil and Gas business units. In this role, he was the primary interface between Global Research and the O&G teams with a mandate of ensuring R&D program relevance and accelerating technology adoption.


Prior to GE, Jim served for five years as a submarine officer in the United States Navy. He earned his bachelor's degree in nuclear engineering from the University of Washington, and following Navy service returned to graduate school at the University of Michigan where he received his master's and doctorate degree in nuclear engineering and radiological
sciences.


 Test Description

Bahgat Sammakia
Binghamton University

Dr. Bahgat Sammakia, a SUNY distinguished professor of mechanical engineering, is the Vice President for Research at Binghamton University.

He is the founding director of S3IP, a New York State Center of Excellence.

He is the director of the Energy Smart Electronic Systems Center, an NSF IUCRC founded in 2011 with a focus on reducing the energy consumed by data centers around the world.

He is the also the director at Binghamton University of the Center for Heterogeneous Integration Research in Packaging (CHIRP) established in 2018 by the SRC and led by Binghamton University and Purdue University. Sammakia served as the interim president of SUNY Polytechnic Institute from December 2016 to June 2018.

He is a fellow of the American Society of Mechanical Engineers, the National Academy of inventors, and the IEEE. Sammakia has contributed to several books on heat transfer, holds 21 U.S. patents and has published more than 250 peer-reviewed technical papers.

Sammakia, who received the SUNY Chancellor’s Award for Excellence in Scholarship and Creative Activities in 2010, was honored with the 2010 ITherm Achievement Award for his contributions to the field of semiconductor thermal management. Sammakia earned his bachelor’s degree from the University of Alexandria in Egypt and his master’s and doctoral degrees from the University at Buffalo. A former IBM senior technical staff member focused on research and development of organic electronic systems, Sammakia joined Binghamton’s faculty of the Watson School of Engineering and Applied Science in 1998.

GENERAL CHAIRS:

Nancy

    Nancy Stoffel

   GE Research

Liang

      Liang Yin

  GE Research

ab

      SB Park

IEEC-Binghamton University

benson

   Benson Chan

IEEC-Binghamton University

    

       

   Deadline has extended to August 28!              There is still time to register!

                                                                                   

    REGISTER NOW                                                                       

                                                                                        

Our Technical Sponsor:

ieeeeps

                   https://eps.ieee.org/

Our Media Sponsors:

meptec

                https://www.meptec.org

3dincites

                  https://www.3dincites.com/

Society Sponsor:

imaps

International Microelectronics Assembly & Packaging Society (IMAPS)

         http://www.imaps.org/

Sponsors:

ase

globalffoundries

samtec