The Integrated Electronics Engineering Center (IEEC), established in 1991, pursues research in electronics packaging. This field deals with the process of bringing a semiconductor chip and/or micro electromechanical (MEMs) device to a form that can be integrated effectively into a larger microelectronics assembly. Most electronics industry experts believe that advances in electronics performance are limited principally by the current state of the art in packaging technology. The market push for greater functional power in smaller and smaller spaces can only be met through increases in packaging density and integration levels of microchips.
The IEEC will be recognized as the premier resource for packaging and systems integration in the electronics industry.
Our mission is to enable economic development by establishing a conduit between the electronics industry and university resources. We promote research on current and emerging technology by enhancing fundamental understanding of engineering problems while providing our students with real-life experiences.