The IEEC, established in 1991, is part of a family of research centers, known as S3IP, which brings together teams of experts from industry and the University to address pressing real-world problems in the systems integration and manufacturing of electronics.
To be recognized as the premier resource for packaging and systems integration in the electronics industry.
The IEEC focuses on research related to electronics packaging. This field deals with the process of bringing a semiconductor chip and/or micro electromechanical (MEMs) device to a form that can be integrated effectively into a larger microelectronics assembly.
Most electronics industry experts believe that advances in electronics performance are limited principally by the current state of the art in packaging technology. The market push for greater functional power in smaller and smaller spaces can only be met through increases in packaging density and integration levels of microchips.
More on S3IP
S3IP is partnered with Binghamton University, SUNY Research Foundation and NYSTAR/ESD for the purpose of assisting companies in New York State and beyond to ultimately generate economic impact.
Our family is recognized as a New York Center of Excellence, and have contributed more than $1 billion in economic impact to New York State since 1996.
We are located in a new $30 million building with unique laboratories and conference facilities at the University's Innovative Technologies Complex at Binghamton University, the premier public university in the Northeast.
Please visit www.binghamton.edu/s3ip for more info on S3IP and our constituent research centers.