The Integrated Electronics Engineering Center (IEEC) held its Technical Advisory Board (TAB) June 12, 2018 at Binghamton University's Center of Excellence. Associate Director, Benson Chan announced the 2018-2019 Pooled Research Projects. Six projects will receive funding at $50,000 and three projects will received "seed" funding at $25,000. A total of nineteen projects were submitted. The 2018-2019 projects are:
- Beyond Silicone Elastomer - Ahyeon Koh
- Computational Study on the Mechanical Properties of Bi alloys for Pb-free Solder - Manuel Smeu
- Micron-level Thermal and Mechanical Characterization of Thermal Interface Materials to Understand Material Variability to Prevent Hot-Spot - Scott Schiffres
- Properties and Use of Fused Nano-Particles – Peter Borgesen
- Smart Chip Mounting Process Control in PCB Assembly Process via Artificial Intelligence - Daehan Won and Sang Won Yoon
- Toward Green and Biodegradable Electronics: Paper-based Printed Circuit Boards - Seokheun Choi
- The Behavior of PbFree Solder Joints Containing Bi: High Melt -Low Melt Solder Interconnect Structures for SMT Applications - Eric Cotts and Nikolay Dimitrov
- Three Phase High Power Density Wide Band Gap (WBG) Devices and Commercial off the Shelf (COTS) Components Based AC to DC Power Converters for More Electric Aircraft System - Pritram Das
- Tomographic Characterization of Waveguides Fabricated by Laser Direct Writing – Bonggu Shim
For additional information, or to partner with us, please contact Benson Chan (chanb@binghamton.edu)