IEEC held its Technical Advisory Board (TAB) meeting

The Integrated Electronics Engineering Center (IEEC) held its Technical Advisory Board (TAB) June 12, 2018 at Binghamton University's Center of Excellence. Associate Director, Benson Chan announced the 2018-2019 Pooled Research Projects. Six projects will receive funding at $50,000 and three projects will received "seed" funding at $25,000. A total of nineteen projects were submitted. The 2018-2019 projects are:

  • Beyond Silicone Elastomer - Ahyeon Koh
  • Computational Study on the Mechanical Properties of Bi alloys for Pb-free Solder - Manuel Smeu
  • Micron-level Thermal and Mechanical Characterization of Thermal Interface Materials to Understand Material Variability to Prevent Hot-Spot - Scott Schiffres
  • Properties and Use of Fused Nano-Particles – Peter Borgesen
  • Smart Chip Mounting Process Control in PCB Assembly Process via Artificial Intelligence - Daehan Won and Sang Won Yoon
  • Toward Green and Biodegradable Electronics: Paper-based Printed Circuit Boards - Seokheun Choi
  • The Behavior of PbFree Solder Joints Containing Bi: High Melt -Low Melt Solder Interconnect Structures for SMT Applications - Eric Cotts and Nikolay Dimitrov
  • Three Phase High Power Density Wide Band Gap (WBG) Devices and Commercial off the Shelf (COTS) Components Based AC to DC Power Converters for More Electric Aircraft System - Pritram Das
  • Tomographic Characterization of Waveguides Fabricated by Laser Direct Writing – Bonggu Shim

For additional information, or to partner with us, please contact Benson Chan (