Gary Miller’s primary role at the IEEC is technology analysis. This involves tracking current electronics packaging activity worldwide as well as predicting future trends and development directions. He keeps extensive files on over fifty packaging related topics. Based on his industry monitoring, literature tracking, and conference attendance, Gary prepares IEEC Flashes, abiweekly packaging news service for member companies which highlights significant late-breaking announcements or developments in the packaging world.
Gary joined the IEEC in January 2000 after retiring as the Chief Mechanical Engineer with Lockheed Martin Control Systems (formally Martin Marietta and General Electric) in Johnson City, New York. He has 30+ years experience in electronic packaging which has included project and program responsibility over a wide range of development activities ranging from CRT displays, lasers, environmental controls, weapon controls, flight controls, and engine controls. Gary was a key developer of liquid cooled Modular Integrated Racks using both conduction and liquid flow avionics modules and has four patents in electronics packaging. He has also served on the Technical Advisory Board for the IEEC at Binghamton University and on the Industrial Advisory Board for Electronic Packaging Research Center (CALCE) at the University of Maryland. Gary received both a Bachelor of Mechanical Engineering and a Master of Engineering from Cornell University.
- MS, BS, Cornell University