Binghamton grad students honored at Electronics Packaging Symposium
Event brings together leaders in academia, industry and government
GE Research and IEEC-Binghamton University hosted the 31st annual Electronics Packaging Symposium - Small Systems Integration in September at the GE Research Center in Niskayuna, N.Y.
The symposium brought together leaders in academia, industry and government to discuss the current electronics packaging research and development. The program included four keynote speakers, 12 technical sessions and 36 exhibitors, as well as student poster sessions and exhibits.
In addition to Binghamton University faculty and graduate students, presentations included students and interns from University of Albany, SUNY Polytechnic Institute, Rensselaer Polytechnic Institute, the U.S. Army Research Lab and GE.
During the poster session, 28 evaluators – a mix of industry, academia and government officials – assessed the student presentations and posters.
The three winning teams were honored by Dean Krishnaswami “Hari” Srihari from Binghamton’s Thomas J. Watson School of Engineering and Applied Science for their excellence in research.
- Authors: Michael Woodcox (poster presenter), Joshua Young, Manuel Smeu
- Faculty Advisor: Manuel Smeu
- Department: Physics
- Title: “Ab initio Investigation of Temperature Dependent Elastic Properties and Solder Interfaces”
- Authors: Jiefeng Xu (poster presenter), Scott McCann, Huayan Wang, Jing Wang, VanLai Pham, Stephen R. Cain, Gamal Refai-Ahmed, S.B. Park
- Faculty Advisor: S.B. Park
- Department: Mechanical Engineering
- Title: “An assessment of Electromigration in 2.5D Packaging”
- Authors: Arun Raj (poster presenter), Manu Yadav, Mohammed Alhendi, Darshana Weerawarne, Peter Borgesen and Mark Poliks
- Faculty Advisor: Peter Borgesen
- Department: Systems Science and Industrial Engineering Department
- Title: “Effect of strain rates and dwell times on damage accumulation in AJP nano-Ag Traces on Upilex”