Student success at the Electronics Packaging Symposium
Matthias Deaumer won second place while Rebecca Loibl and Morteza Bagheri received honorable mention.
GE Global Research, in conjunction with the Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology at Binghamton University and the Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 29th annual Electronics Packaging Symposium & Heterogeneous Integration Workshop Sept. 19-20 at GE Global Research in Niskayuna, N.Y.
With support from mechanical engineering assistant professor Scott Schiffres, three Binghamton University students saw success at the symposium.
Matthias Daeumer, a master’s student, won second place for his poster “Frequency-Domain Thermorelfectane Method for Micro/Nano-Scale Thermal Characterization” which was done in collaboration with Charles Arvin of IBM.
Rebecca Loibl, an undergraduate student, and Morteza Bagheri, a PhD student, received honorable mention for their poster “Investigation of Graphene Oxide Adsorption.” Loibl was also the only undergraduate student to have a poster at the conference.