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A New York State Center of Excellence at Binghamton University

News and Events

May
14
Mon
May
20
Sun
11:00am - 12:00pm
May
28
Mon
8:00am - 5:00pm
Sheraton San Diego Hotel & Marina, 1380 Harbor Island Dr, San Diego, CA 92101, USA
Sponsored by the IEEE's Electronic Packaging Society (EPS), ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series. In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. All papers will be peer reviewed and published in the ITherm proceedings. For more information, please visit http://www.ieee-itherm.net/itherm/conference/home
8:00am - 5:00pm
Sheraton San Diego Hotel & Marina, 1380 Harbor Island Dr, San Diego, CA 92101, USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. For more information, please visit: http://ectc.net/
Jun
3
Sun
7:00am - 5:00pm
Hilton Orlando Bonnet Creek, 14100 Bonnet Creek Resort Ln, Orlando, FL 32821, USA
This Conference is designed for anyone involved with 7×24 infrastructures – IT, data center, disaster recovery and network/ telecommunication managers, computer technologists, facility or building managers, supervisors and engineers.
Jun
12
Tue
Jun
17
Sun
11:00am - 12:00pm
Jul
15
Sun
11:00am - 12:00pm
Aug
19
Sun
11:00am - 12:00pm
Sep
16
Sun
11:00am - 12:00pm
Sep
18
Tue
8:00am - 5:00pm
Binghamton University ITC
Sep
20
Thu
Oct
8
Mon
8:00am - 5:00pm
Pasadena Convention Center, 300 E Green St, Pasadena, CA 91101, USA
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on: Modules- SiP/SiM (System Solutions) Wafer Level/Panel Level (Advanced RDL) High Performance/Reliability - Defense/Aero/Medical Flip Chip/2.5D/3D - Advanced Package Process, Materials and CPI For more information, please visit http://www.imaps.org/imaps2018/
Oct
14
Sun
11:00am - 12:00pm
Oct
24
Wed
Nov
19
Mon
11:00am - 12:00pm
Dec
17
Mon
11:00am - 12:00pm
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Last Updated: 2/6/18