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A New York State Center of Excellence at Binghamton University

News and Events

Feb
24
Sat
11:00am - 3:00pm
Oakdale Mall, Johnson City, NY 13790, USA
Binghamton University annually holds its outreach event at the Oakdale Mall in February. Faculty, staff and students have an opportunity to showcase their work through hands-on demonstrations, table displays and performances. Members of the public each year are encouraged to come and spend an hour or two exploring all that the University has to offer. Binghamton University Day at the Mall 2018 will be held Saturday, February 24 from 11 a.m. until 3:00 p.m. If you would like additional information about the event or would like to sign-up to participate in 2018, contact Darcy Fauci at dfauci@binghamton.edu.
Mar
5
Mon
8:00am - 9:00am
We-Ko-Pa Resort and Conference Center, 10438 N Fort McDowell Rd, Fort McDowell, AZ 85264, USA
The 14th Annual Device Packaging Conference (DPC 2017) will be held in Fountain Hills, Arizona, on March 5-8, 2018. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals. For more information, visit: http://www.imaps.org/DevicePackaging/index.htm
Mar
19
Mon
8:00am - 5:00pm
DoubleTree by Hilton Hotel San Jose, 2050 Gateway Pl, San Jose, CA 95110, USA
11:00am - 12:00pm
Mar
26
Mon
8:00am - 5:00pm
Jacob K. Javits Convention Center, 655 W. 34th St, New York, NY 10001, USA
The Future of Energy is Here - our theme for AEC 2018, will demonstrate how the decades of research and development in renewables, batteries and other technologies are realizing their potential - here today - as vibrant sectors of our economy. Join us and celebrate our industry's achievements in new areas of power generation, witness promising new areas of research, and network with the leaders who are exploring those technologies and shaping global energy policies. For more information, please visit http://www.aertc.org/aec2018/
Apr
16
Mon
11:00am - 12:00pm
May
14
Mon
May
20
Sun
11:00am - 12:00pm
May
28
Mon
8:00am - 5:00pm
Sheraton San Diego Hotel & Marina, 1380 Harbor Island Dr, San Diego, CA 92101, USA
Sponsored by the IEEE's Electronic Packaging Society (EPS), ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series. In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. All papers will be peer reviewed and published in the ITherm proceedings. For more information, please visit http://www.ieee-itherm.net/itherm/conference/home
8:00am - 5:00pm
Sheraton San Diego Hotel & Marina, 1380 Harbor Island Dr, San Diego, CA 92101, USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. For more information, please visit: http://ectc.net/
Jun
12
Tue
Jun
17
Sun
11:00am - 12:00pm
Jul
15
Sun
11:00am - 12:00pm
Aug
19
Sun
11:00am - 12:00pm
Sep
16
Sun
11:00am - 12:00pm
Sep
18
Tue
8:00am - 5:00pm
Binghamton University ITC
Sep
20
Thu
Oct
8
Mon
8:00am - 5:00pm
Pasadena Convention Center, 300 E Green St, Pasadena, CA 91101, USA
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on: Modules- SiP/SiM (System Solutions) Wafer Level/Panel Level (Advanced RDL) High Performance/Reliability - Defense/Aero/Medical Flip Chip/2.5D/3D - Advanced Package Process, Materials and CPI For more information, please visit http://www.imaps.org/imaps2018/
Oct
14
Sun
11:00am - 12:00pm
Oct
24
Wed
Nov
19
Mon
11:00am - 12:00pm
Dec
17
Mon
11:00am - 12:00pm
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Last Updated: 2/6/18