The Integrated Electronics Engineering Center (IEEC) is a New York State Center for Advanced Technology in Electronics Packaging. Formed in 1991, the IEEC is dedicated to the advancement of electronic packaging technology and the electronics industry. We conduct leading edge research in a wide variety of packaging areas for the technological and economic benefit of our member companies. The combined expertise and facilities of the IEEC and associated Engineering and Science departments at Binghamton University are available to affiliated companies to help advance their business.
2016 Electronics Packaging Symposium Information & Registration- coming soon!