The Integrated Electronics Engineering Center (IEEC), established in 1991, pursues research in electronics packaging. This field deals with the process of bringing a semiconductor chip and/or micro electromechanical (MEMs) device to a form that can be integrated effectively into a larger microelectronics assembly. Most electronics industry experts believe that advances in electronics performance are limited principally by the current state of the art in packaging technology. The market push for greater functional power in smaller and smaller spaces can only be met through increases in packaging density and integration levels of microchips.
The IEEC will conduct transformational research in the area of electronic systems integration and packaging that will have a broad impact on society and its partners and will contribute to their technological and economic success.Although we gladly work with any company in the nation, our regional concentration is New York State, with special emphasis on the Binghamton area.
- To conduct world class electronics packaging research that provides significant technological advantage to its customers
- To provide physical and intellectual infrastructure and expertise that will help its customers be successful in their business
- To enable its partners to network and grow their customer and partner base
- To enable economic growth in the electronics industry throughout the nation and the region.
- To provide high quality and real-world relevant educational experiences to our students in the interdisciplinary field of electronics packaging.