BINGHAMTON, NY – Binghamton University’s Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology in electronics packaging, in conjunction with General Electric Global Research Center, and the IEEE Component, Packaging and Manufacturing Society, will host the annual Electronics Packaging Symposium on October 9-10, 2012 at GE Global Research, Niskayuna, NY.

The symposium will focus on electronics packaging, which encompasses essentially all components of computers, cell phones and other electronic devices except for the integrated circuit or chip.  The Binghamton and Albany areas each have a long history of technical leadership in this area through Binghamton University, General Electric, IBM, Endicott Interconnect, Lockheed Martin, Universal Instruments and many other regional companies.

“Binghamton University has a world-class program and we are proud to host this event in conjunction with a great innovation partner, like the IEEC,” said Kaustubh Nagarkar, systems engineer in the Electronics Packaging Lab at GE Global Research. “Electronics packaging is critical to virtually all electronics on the market today; from consumer devices, like cell phones, to high-power electronics used in energy and aviation applications. Symposiums like this will foster collaboration and help lead to further advances.”

Topics of discussion will include packaging trends, thermal management, 3-D packaging, sensors, electronics packaging for harsh environments, miniaturization, and flexible/printed electronics.

The symposium will include a student poster session, networking reception and dinner speaker. More information on cost of attendance and registration details are available at http://www2.binghamton.edu/ieec/symposium2012/index.html.

For more information, contact Bill Infantolino, associate director of the IEEC, at binfanto@binghamton.edu or 607-777-4349