Center for Heterogeneous Integration Research in Packaging (CHIRP)


Current CHIRP research projects include:

  • Conformal Polymeric Thin Films Manufacturing Using Electrospray Printing, led by Paul Chiarot
  • Fine Pitch Cu-Sn Based Interconnection Below Temperatures of 180oC, led by Nikolay Dimitrov
  • Reliable Low Temperature Solder Approach, led by Peter Borgesen
  • Design, Fabrication, and Testing of Metal Porous Media for Thermal Capacitor and Immersion Cooling Applications, led by Bahgat Sammakia