Next Generation Electronic Systems: Heterogeneous Integration, Thermal and Power Management, Related Machine Learning

October 6-8, 2020

Binghamton University and the Indian Institutes of Technology at Madras and Ropar co-hosted this Zoom workshop to strengthen our relationships with industry through knowledge sharing, and to raise awareness of our current research and opportunities for collaboration. Most presentations and recordings of presentations can be found below:

October 6, (Day 1)
Battery Energy Storage: Past, Present and Future Directions M. Stanley Whittingham Nobel Laureate Binghamton University

Recording not available

Presentation not available

Research Overview and Collaborations  Sarit Das  Professor and Director  IIT Ropar  Recording Presentation
Energy and Carbon Management for Next Generation Electronic Systems Rangan Banerjee Professor, Energy Engineering IIT Bombay  Recording Presentation

Implementing Smarter Electronics Manufacturing Schemes

SB Park Professor and Director, IEEC Binghamton University  Recording  
Wide Band Gap SiC Based Novel Single Stage Power Converter Topologies for Solid State Transformers Pritam Das Assistant Professor Binghmton University Recording Presentation
Thermal and Electric Co-Simulation of High-Speed Signals Bhyrav Mutnuru Senior Distinguished Engineer  Dell Recording  
October 7 (Day 2)
     
Recent Trends in Thermal Management of HPC/Supercomputing Systems  Sanjay Wandhekar  Senior Director  CDAC Recording Presentation
Heterogeneous Integration Roadmap - Driving Force for System of the Future  William Chen  ASE Fellow ASE Recording Presentation
Going beyond Conventional Heat Pipes: Pulsating and Loop Heat Pipes as Passive Thermal Management Options for Electronics Cooling  Sameer Khandekar  Professor, Mechanical Engineering  IIT Kanpur  Recording Presentation
Liquid Cooling of HI Systems: an Emphasis on Cold Plate Optimization Bahgat Sammakia/ Srikanth Rangarajan Vice President for Research Binghamton University Recording Presentation
3D Printing for Enhanced Electronics Cooling Scott Schiffres Associate Professor Binghamton University Recording  
Design and Technology Challenges with on Package Heterogeneous Integration Arun Chandrashekar

Sr. Principal Engineer

Intel, Bangalor  Recording Presentation
Advanced Manufacturing of Flexible Electronics Mark Poliks

Professor

Binghamton University  Recording  
October 8 (Day 3)
     
Accelerating Biology: Computing, Analytics, Visualization and Beyond Rajendra Joshi

Senior Director

CDAC Recording not available  Presentation not available 
Dynamic Management of IT, Cooling, Power and Renewables for Data Centers Kanad Ghose

Distinguished Professor 

Binghamton University Recording  
Advanced Packaging Architectures for Heterogeneous Integration Ravi Mahajan

Intel Fellow

Intel Recording Presentation
Advancing AI through System and Packaging Innovations

Arvind Kumar

Manager

IBM Recording Presentation
Recent Advances in Statistical Machine Learning for Uncertainty Quantification of High-Speed Circuits

Sourajeet Roy

Assistant Professor

IIT Roorkee Recording Presentation
Looking Under the Hood of Deep Neural Networks Balaraman Ravindran

Professor

IIT Madras Recording  
Role of Machine-Learning in Physics-Based Simulation Dipanjan Gope

Associate Professor

IISc Bangalore Recording  

For more information: Andrea Palmeri - apalmeri@binghamton.edu