Funded by the Department of Defense, and led by Purdue University, SCALE at Binghamton University provides classes and research opportunities in the areas of Heterogeneous Integration and Advanced Packaging to undergraduate and graduate students to prepare them for a career in the microelectronics industry.
Current SCALE students at Binghamton include:
| Name/LinkedIn | Research Interest | Est. Grad. Date |
| Aleah Shron |
My research focuses on understanding the behavior of electrokinetic and electromechanical at the micro- and nanoscale can help create new technologies. Specifically, I am observing how nanowires move around in liquids when electricity is applied. By changing the type and strength of the electric field, we can control how these tiny wires move, spin, and line up. |
2026/BS and 2027/MS |
| Calvin Choi | My research focuses on warping of samples under heat stress and 3D reconstruction of objects underground using Ground Penetrating Radar (GPR) | May 2026 |
| Shalmalee Deshpande | We employ optical tomography to visualize the 3D index profiles of commercial fibers and laser-fabricated waveguides. We also investigate the applications of machine learning to assist tomography when faced with limited-angles. | May 2027 |
| Cameron Kranz | I am currently taking the packaging class WTSN 582 that covered the fundamentals of the chip development process from the perspective of various disciplines. | May 2027 |
| Trinay Ravella | My research focuses on Thermal Cooling Applications for Microprocessors in Aerospace Situations. | Dec 2028 |
| Olesya Gorbunova | My research is focused on materials discovery for microelectronic applications (materials in interconnects, semiconductors, superconductors). Our group is currently investigating the use of universal machine learning potentials to accelerate the search for novel materials. | Dec 2025 |
| Uwe Anselm | I do product teardown analysis of consumer products to understand their internal design choices. I used tools like X-ray imaging and microscopy to study component layout, material selection, and failure points at a deeper level. |
2028 |
| Amr Bekhit | I'm currently taking WTSN 582 - Packaging Class | 2026/BS and 2027/MS |
| Eugene Fung |
My research deals with the reliability and thermal behavior of printed electronics. Specifically, my research focuses on understanding the electrical and mechanical reliability of aerosol jet printed gold conductors on ceramic substrates for high temperature applications. By studying resistance stability, temperature coefficient of resistance (TCR), and material behavior under extended thermal aging, the work aims to evaluate the suitability of printed gold traces for use in extreme environment electronics such as defense systems, propulsion technologies, and high temperature-sensing. |
May 2026 |
| Jeff Lam |
My research focuses on printing eddy coil components for the purpose of creating a new form of an Eddy Current Array Probe (ECAP) as a flexible hybrid electronic. Useful for conforming to complex metallic bodies to better detect structural defects and cracks within core engineering machines. |
May 2027 |
| Alina Tharian |
My research focuses on understanding the process of failure mechanisms in microchannel liquid cooling systems, specifically erosion and clogging. I'm conducting literature reviews to identify clogging and erosion models and attempting to create a hybrid model by creating a parameterized compact modeling tool. |
May 2026 |
| Kevin Wilk |
I've performed thermal analysis of various heatsink/chip stacks through multiphysics simulation as well as physical experimentation for the determination of thermal conductivity values for thin film materials. I'm currently looking into the electromechanical properties and motion of microscale particles specifically ferrofluids using simulation methods |
MS |