Our Team

headshot of William Butler

William Butler

Research Engineer

S3IP – Small Scale Systems Integration and Packaging


William Butler received his bachelors of science in mechanical engineering from Clarkson University and a master’s degree in mechanical engineering from Binghamton University, where he studied shock and vibration of populated printed circuit boards. In 2007, he joined the Analytical and Diagnostics Laboratory, where he works with sample preparation tools such as grinding and polishing, thermal tools including Thermo Gravimetric Analyzer (TGA), Differential Scanning Calorimetry (DSC), Thermo Mechanical Analyzer (TMA), flash diffusivity and Dynamic Mechanical Analyzer (DMA), optical microscope and optical profilometry. He also provides IT support to keep the computers running and manages the FOM system.