The Center for Advanced Microelectronics Manufacturing

The Center for Advanced Microelectronics Manufacturing brings government, academia and industry together to develop the next generation of roll-to-roll and printed flexible electronics manufacturing capabilities.

Flexible hybrid electronics use traditional chips as well as electronics printed on plastic, thin glass, paper and fabric materials that can bend. Applications include medical diagnostics and treatment, military and homeland security, flexible displays, telecommunications and a variety of consumer products.

A partnership of Binghamton University, i3 Electronics, Cornell University and the FlexTech Special Interest Group, the CAMM is the nation's first prototype research and development facility in large-area flexible electronics. Established in 2005, the CAMM is part of S3IP, Binghamton's New York State Center of Excellence, which serves as an international resource for systems integration and packaging R&D.
Our laboratory and 10,000-square-foot clean room in Endicott, N.Y., offer unique capabilities, including manufacturing-scale tools for complex printing, vacuum deposition and lithographic patterning.

The CAMM is the New York node of NextFlex, a $75 million, five-year federal initiative to advance flexible hybrid electronics manufacturing. The CAMM is taking a role in creating technology ecosystems as well as educating the next generation of materials scientists and engineers.

The CAMM has:
• Developed a manufacturing process for a flexible catheter that improves diagnostics for patients with heart disease
• Worked with Corning Inc. to demonstrate roll-to-roll processing of thin flexible glass
• Developed fabrication processes for a physiological monitor that tracks EKG, temperature and oxygenation for use by members of the armed forces, athletes and hospital patients
• Significant expertise in additive manufacturing of electronics including aerosol jet printing, process monitoring and controls