NextFlex designated Binghamton University as the New York "Node" for its flexible hybrid electronics (FHE) initiative in 2018. As the NextFlex New York Node, Binghamton will design, develop and manufacture tools; process materials and products for flexible hybrid electronics; and attract, train and employ an advanced manufacturing workforce, building on the region's existing electronics manufacturing base.

This designation extends the mission of the Center for Advanced Microelectronics Manufacturing, which was established in 2005. The Flex Tech Alliance (formerly the United States Display Consortium) selected Binghamton University, a global leader in electronics packaging and small scale systems integration, in partnership with Endicott Interconnect Technologies Inc. and Cornell University, to spearhead development of next-generation roll-to-roll (R2R) electronics manufacturing capabilities. A unique collaborative effort, the CAMM continues to bring together partners from government, industry and academia to tackle the myriad challenges of this technology.

The mission of the Center for Advanced Microelectronics Manufacturing at Binghamton University is to demonstrate the feasibility of roll-to-roll (R2R) flexible electronics manufacturing by acquiring prototype tools and establishing processes capable of producing low volume test bed products. R2R microelectronics manufacturing will be key to critical next-generation applications in myriad areas, such as medical diagnostics and treatment, military and homeland security, flexible displays and electronics, computer and telecommunications and consumer products.

The CAMM's goals are to:
• map emerging flexible electronic technologies
• validate the design of flexible electronic manufacturing capabilities
• develop essential process technologies and manufacturing know-how
• demonstrate specific technologies and products through test-bed projects and low-volume device manufacturing.